Side opening unified pod

ABSTRACT

A substrate processing system including a processing section arranged to hold a processing atmosphere therein, a carrier having a shell forming an internal volume for holding at least one substrate for transport to the processing section, the shell being configured to allow the internal volume to be pumped down to a predetermined vacuum pressure that is different than an exterior atmosphere outside the substrate processing system, and a load port communicably connected to the processing section to isolate the processing atmosphere from the exterior atmosphere, the load port being configured to couple with the carrier to pump down the internal volume of the carrier and to communicably connect the carrier to the processing section, for loading the substrate into the processing section through the load port.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. Non-Provisional applicationSer. No. 14/822,392, filed on Aug. 10, 2015 (now U.S. Pat. No.9,978,623), which is a continuation of U.S. Non-Provisional applicationSer. No. 12/123,391 filed on May 19, 2008, (now U.S. Pat. No.9,105,673), which claims the benefit of and priority from U.S.Provisional Patent Application No. 61/043,097 filed on Apr. 7, 2008,U.S. Provisional Patent Application No. 61/024,152 filed on Jan. 28,2008, and U.S. Provisional Patent Application No. 60/930,634 filed onMay 17, 2007 the disclosures of which are incorporated by referenceherein in their entireties.

BACKGROUND 1. Field

The disclosed embodiments relate to interface systems for reducingparticle contamination of substrates during processing.

2. Brief Description of Related Developments

There is a desire in the semiconductor industry to reduce wafer cycletime through the FAB and reduce the amount of work in progress (WIP) aswell as to improve wafer safety. Conventionally, the carrier to loadport physical interface is a multi-step process involving up to sixmechanisms to perform the carrier load and unload operation. In thisenvironment, the load port cycle time ranges for example from 12-18seconds depending on the manufacturer and can reach 2 million cyclesover a 7 year life in extreme applications. A lot size of 25 wafers perconventional carrier is used to optimize tool utilization and minimizethe effect of tool setup and wafer handling overhead. Conventionalsemiconductor manufacturing has been generally focussed on high volumewith a low mix of product types flowing through the production line. Incontrast, the practices of the manufacturing environment has tended tomigrate so that it consists of many product types of both high and lowvolume. Essentially, changes in the semiconductor business model aredriving fab managers to minimize inventories and reduce manufacturingcycle times. The later is heavily influenced by the lot size in thewafer carrier. Some suggest that a lot size smaller than 13 wafers is apoint at which significant gains in cycle time can be realized. One endof this approach is to drive the lot size for example to a single wafer.Although a single wafer may be theoretically ideal, the current state ofprocess tool architecture is not compatible with the level of recipechanges related thereto and thus drives up tool setup time. The lengthof setup time on some tools can be equal to or greater than theprocessing time of the single wafer negating the original intentions. Inaddition, due to the complexity in characterizing advanced processtools, it is desired that some number of test or qualification wafersconfirm that the process is operating within specification. Thesenon-product wafers may be used and handled in conjunction with a singlewafer strategy.

A smaller, multi-wafer lot size may be effectively employed to supportthe single wafer strategy. However, as may be realized, variance in thelot size of the carrier has a commensurate impact on the load portdesign. Specifically, the cycle time of the load port may be generallylinearly proportional to the lot size. For example, to avoid limitingthe process tool throughput a 12 second cycle time on a 25 wafer lot mayuse a 2.4 second cycle time on a 5 wafer lot. Recalculation of the loadport life with a reduced cycle time results in 10 million cycles over a7 year life for the same steady state throughput. A further aspect of aload port which can open or close the carrier in ⅕ of the time it mustpossess inherent reliability; otherwise, the mean cycle between failures(MCBF) of the load port will negatively impact the tool level MCBF.

On the other hand, the impact to the carrier from a reduction in lotsize and cycle time is two-fold. First, the lot size reduction impactsthe time to open or close the carrier on the load port. Second,manufacturing cycle time impacts the number of desired open/close cyclesof the carrier. A simple calculation can approximate the total cycles ofa carrier based upon the number of mask layers, process steps per layerand the days per mask layer. Currently 27 mask layers with 32 processsteps each are typical. The number of days per mask layer variesdepending on the device and manufacturer but a reasonable estimate is1.5 days per masks layer. For the purposes of the example calculation itmay be assumed that the carrier may be loaded onto a different tool foreach process step (a conservative assumption).Process Steps÷Days per Mask Layer=Cycles_(Carrier)/Day32÷1.5=21.33 Cycles_(Carrier)/Day

Taken to the extreme, device manufacturers have suggested that it ishighly desired that the days per mask layer be reduced to 1-0.7 days toachieve optimal productivity and that future-devices may employ up to 45mask layers. Inserting the forecasted changes into our previous examplecalculation we compute the following new values for carrier cycle time.The number of process steps per mask layer is assumed to be unchanged.Process Steps÷Days per Mask Layer=Cycles_(Carrier)/Day32÷0.7=45.7 Cycles_(Carrier)/Day

Based on the previous exemplary calculations we can derive the cyclesover a seven year life of the carrier to be between 54,498 and 116,764.In other words a carrier may be subjected to open and close cycle every31.5 minutes. Conventional load ports, carriers and the interfacetherebetween cannot satisfy the anticipated operational parameters.Associated with the desire for more robust carrier and carrier to toolinterface (for example with respect to ability to withstandsubstantially higher (e.g. X2-X10) cycles and hence provide highercleanliness within the carrier and across the interface) is the desireto simplify and speed the system that gets the substrates to thedifferent process modules, that carry out the various process steps,bending what is achievable with conventional load ports and carriers.

SUMMARY

In one exemplary embodiment a substrate processing system is provided.The substrate processing system includes a processing section arrangedto hold a processing atmosphere therein, a carrier having a shellforming an internal volume for holding at least one substrate fortransport to the processing section, the shell being configured to allowthe internal volume to be pumped down to a predetermined vacuum pressurethat is different than an exterior atmosphere outside the substrateprocessing system, and a load port communicably connected to theprocessing section to isolate the processing atmosphere from theexterior atmosphere, the load port being configured to couple with thecarrier to pump down the internal volume of the carrier and tocommunicably connect the carrier to the processing section, for loadingthe substrate into the processing section through the load port.

In accordance with another exemplary embodiment, a substrate carrierconfigured for coupling to a load port of a substrate processing systemis provided. The substrate carrier includes a shell and an internalvolume formed by the shell, wherein the shell is configured such thatthe internal volume can be pumped down to a predetermined vacuumpressure when the carrier is substantially located in an atmosphericenvironment.

In accordance with still another exemplary embodiment, a method isprovided. The method includes coupling a substrate carrier to a loadport of a substrate processing system and pumping down an internalvolume of the substrate carrier to a predetermined vacuum pressure whileone or more exterior surfaces of substrate carrier are exposed to anatmospheric environment.

In accordance with yet another exemplary embodiment, a substrateprocessing system is provided. The substrate processing system includesa carrier for holding substrates therein, the carrier having first andsecond carrier registration features, and a load port configured tocommunicably connect the carrier to a processing section of thesubstrate processing system, the load port comprising, a first carrierinterface having first registration features configured such as to forma first kinematic coupling with the first carrier registration featuresfor coupling the carrier to the first carrier interface, and a secondcarrier interface arranged at an angle in relation to the first carrierinterface, the second carrier interface having second registrationfeatures configured such as to form a second kinematic coupling with thesecond carrier registration features for coupling the carrier to thesecond carrier interface, wherein the second registration features areconfigured to allow movement of the carrier relative to the secondcarrier interface when the carrier is coupled by the second kinematiccoupling to the second carrier interface so that the second carrierregistration features allow coupling of the first registration featureswith the first carrier registration features

In accordance with still another exemplary embodiment, a method isprovided. The method includes registering a carrier on a firstregistration interface and translating the first registration interfaceto advance the carrier towards a second registration interface whereincontact between the carrier and second registration interface causesrelative movement between the carrier and first registration interfacefor transferring registration of the carrier from first registrationinterface to the second registration interface.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and other features of the exemplary embodiment areexplained in the following description, taken in connection with theaccompanying drawings, wherein:

FIGS. 1A-1B are respectively schematic elevation views of a substrateprocessing tool and one or more substrate carriers or pods incorporatingfeatures in accordance with an exemplary embodiment;

FIG. 2 is a schematic partial elevation view of a load port of theprocessing tool in FIG. 1 and carriers interface with the load port;

FIG. 3 is another schematic partial elevation view of a load portinterface and carrier;

FIGS. 3A-3L illustrate exemplary latches in accordance with exemplaryembodiments;

FIGS. 4A-4E are other schematic partial elevation views of the load portinterface and carrier respectively showing the load port interface andcarrier in different positions;

FIG. 4F is a flow chart graphically illustrating a process of carrier toload port interface in accordance with an exemplary embodiment;

FIGS. 5A-5B illustrate schematic views of a carrier and load portinterface in different positions;

FIG. 6 is a schematic elevation view of a load port interface andcarrier in accordance with another exemplary embodiment;

FIG. 6A is a flow chart graphically illustrating a process of carrier toload port interface in accordance with an exemplary embodiment;

FIGS. 7A-7C respectively are a schematic partial elevation view andenlarged partial elevation view of load port interface and carrier(s);and a schematic perspective cross section of load port interface andcarrier in accordance with another exemplary embodiment;

FIGS. 8-8A respectively are schematic perspective and side elevationviews of a carrier in accordance with another exemplary embodiment;

FIGS. 9A-9C respectively are a schematic perspective view of a load portinterface and cross-sectional views of different portions of the loadport interface engaging a carrier in accordance with another exemplaryembodiment;

FIG. 10 is a top cross-sectional view of the load port interface andcarrier.

FIG. 11 is a schematic perspective view of engagement features of akinematic coupling between carrier and tool interface in accordance withanother exemplary embodiment;

FIGS. 12-12A are respectively a schematic elevation and partialelevation views of another carrier to tool interface coupling inaccordance with another exemplary embodiment, and FIG. 12B is anotherschematic elevation view of the carrier to tool interface illustratingpaths for carrier and port door movement in accordance with an exemplaryembodiment;

FIGS. 13-13A are schematic views of carrier and tool interface inaccordance with yet another exemplary embodiment, and FIG. 14 is apartial view of a carrier another interface in accordance with stillanother exemplary embodiment;

FIGS. 15 and 15A are schematic elevation views of a substrate processingtool and carrier connected thereto in accordance with another exemplaryembodiment;

FIGS. 16, 16A and 16B are a schematic plan views of substrate processingtools and carriers connected thereto in accordance with other exemplaryembodiments;

FIG. 17 is a schematic elevation view of substrate processing tool andcarrier connected thereto in accordance with another exemplaryembodiment; and

FIGS. 18, 18A and 18B are schematic plan views of a substrate processingtools and carriers connected thereto in accordance with other exemplaryembodiments;

FIGS. 19 and 20 are respectively perspective and side views of anactuator in accordance with an exemplary embodiment;

FIG. 21 shows an object coupled to a first interface surface of, forexample, a load port in accordance with an exemplary embodiment;

FIGS. 21A and 21B illustrate a kinematic coupling between the object andload port of FIG. 21 in accordance with an exemplary embodiment;

FIG. 22 illustrates another interface surface of the load port of FIG.21 in accordance with an exemplary embodiment;

FIGS. 22A and 22B illustrate exemplary kinematic coupling features ofthe object and load port of FIG. 21 in accordance with an exemplaryembodiment;

FIGS. 23-25 illustrates a coupling of the object from the firstinterface surface to the second interface surface of FIGS. 21 and 22 inaccordance with an exemplary embodiment; and

FIGS. 26 and 27 illustrate schematic views of a substrate carrier inaccordance with exemplary embodiments.

DETAILED DESCRIPTION

Referring to FIGS. 1A-1B, there is shown a schematic elevation view of asubstrate processing apparatus 2, and substrate carriers or pods 100incorporating features in accordance with exemplary embodimentsdescribed further below.

Still referring to FIGS. 1A-1B, the processing tool 2 illustratestherein is merely representative and in alternate embodiments theprocessing tool may be of any desired type and may have any desiredconfiguration. By way of example, (it is noted that no example describedherein is meant as limitation on the features of the exemplaryembodiments), the processing tool may be arranged to perform materialdeposition, ion implantation, etching, lithography, polishing or anyother desired process. The tool for example may also be a metrologytool. In the exemplary embodiment shown, tool 2 may generally have aprocess section 6 and a front end module (FEM) 4 (if using a referenceconvention in which wafers may be considered to be loaded into the toolfrom the front). The process section 6 may be isolated and hold desiredprocess atmosphere(s) (e.g. vacuum, inert gas (N2) . . . ). The FEM 4may be connected to the process sections. In the exemplary embodimentshown, the FEM 4 may contain an atmosphere common with the processsection (e.g. a process atmosphere, such as an inert gas). In theexemplary embodiment, the FEM 4 may isolably communicate with processsection 6 via a load lock(s) (for example if the portions of the processsection may be at vacuum). In alternate embodiments, the FEM may have aclean air atmosphere and in other alternate embodiments the process toolmay not have a FEM, and the process section may interface directly withsubstrate carriers. The carrier(s) 100 may be configured, as will bedescribed below, to allow interface of the carrier directly to theprocess section 6 independently of the gas species in the processsection or carrier or whether the process section is vacuum. As seen inFIGS. 1A-1B, the FEM 4 has an interface(s) for substrate carriers 100.The interface, which may also be referred to as a load port 10, allowscarriers to interface the FEM 4, and hence the tool 2, in order to allowloading and unloading of wafer/substrates to and from the tool. The FEM4 may include desired environmental controls (as will be describedfurther below) to enable loading of wafers (from an environment exteriorto the tool) into the tool without degradation of the processatmosphere. The carrier(s) may define a chamber holding the substratesfor example in a clean atmosphere (with a gas species that may be thesame or different than the process atmosphere. The interface betweencarrier and load port may define what may be referred to as a cleantunnel between carrier chamber in which the substrates are transported,between carrier chamber and process atmosphere, such as in the FEM 4 orin the process section 6, without degradation of the process atmosphereas will be described in greater detail below.

Referring also to FIG. 2, which is an enlarged partial schematicelevation view of the load port 10 and carriers 100, the communicationinterface I (e.g. clean tunnel) between the carrier chamber and the FEMatmosphere, may generally include for example interfaces that may begenerally identified, for example purposes, as carrier shell to carrierdoor interface 103, carrier shell to load port flange interface 101 andcarrier door to load port door interface 105 and load port door to loadport flange interface 13. In alternate embodiments the interface thateffects communication between carrier chamber and FEM atmosphere orprocess section atmosphere or vacuum may have any other desiredconfiguration with more or fewer interfaces, (for example two or more ofthe aforementioned interfaces may be combined into a common interface).As may be realized, in the exemplary embodiment, the clean tunnel(between carrier chamber and process atmosphere) provided by themulti-interface I may be open or closed (e.g. opened when the carrier isinterfaced with the load port and closed at all other times untilcarrier interface is complete). The clean tunnel remains clean (e.g.substantially no degradation to the interior atmosphere) when the tunnelis open and closed as well as during opening and closing of the tunnel.Thus as may be realized to establish and maintain the clean tunnel, eachof the interfaces of the communication multi-interface I may be sealedas the given interface is closed such as to isolate the carrier chamberatmosphere, or process atmosphere from an outside atmosphere or dirtysurfaces (such as may be subjected to exterior atmosphere). For examplecarrier shell to carrier door interface 103 may be sealed to isolate thecarrier atmosphere, and load port door to load port flange interface 13may be sealed to isolate the FEM or process section atmosphere or vacuum(such as when the clean tunnel is closed). Also the carrier door to loadport door interface 105 may be sealed to isolate exterior (e.g.dirty/surfaces for example on the carrier door and load port door fromthe clean tunnel atmosphere, and the carrier shell to load port flangeinterface 101 may be sealed to isolate the process atmosphere from theoutside atmosphere (such as when the clean tunnel is opened). In theexemplary embodiment, the interfaces, such as between carrier shell anddoor 103, shell and load port flange 101, carrier door and load portdoor 105, and load port flange and door 13 may be solid state at leastin part as will be described further below, to minimize moving partsexposed to the clean tunnel. Suitable examples of interfaces betweencarrier and load port are described in U.S. patent application Ser. No.11/207,231, filed Aug. 19, 2005; Ser. No. 11/211,236, filed Aug. 24,2005; Ser. No. 11/210,918, filed Aug. 23, 2005; Ser. No. 11/594,365,filed Nov. 7, 2006; Ser. No. 11/787,981, filed Apr. 18, 2007; and Ser.No. 11/803,077, filed May 11, 2007 all incorporated by reference hereinin their entirety.

Still referring to FIGS. 1A-1B and 2, in the exemplary embodiment theload port 10 may be configured to interface with reduced or smallcapacity carriers 100. Suitable examples of small capacity carriers withfeatures similar to carriers 100 and suitable examples of a load portinterface with features similar to load port 10 are described in U.S.patent application Ser. No. 11/207,231, filed Aug. 19, 2005; Ser. No.11/211,236, filed Aug. 24, 2005; Ser. No. 11/210,918, filed Aug. 23,2005; Ser. No. 11/594,365, filed Nov. 7, 2006; Ser. No. 11/787,981,filed Apr. 18, 2007; and Ser. No. 11/803,077, filed May 11, 2007previously incorporated by reference herein. In the exemplaryembodiment, the load port interface 11 may be arranged for example tomeet present EFEM interface standards. For example, the load port 10 mayfit within the BOLTS interface established by SEMI E63, such as for aconventional twenty-five (25) wafer load port, and may position thecarriers 100 within the space envelope identified by SEMI E15.1. In theexemplary embodiment load port 10 having a generally stacked load portconfiguration capable of interfacing a stack of carriers 100, andpresenting substrates, within the carriers, to the tool transportapparatus such as at a height between what would be the lowest andhighest wafers in a twenty-five (25) wafer stack of a carrier conformingto the standards in SEMI E47.1 sitting on the SEMI E151 load port. Inthe exemplary embodiment, three load port sections 10A, 10B, 10C areshown (for example purposes, and in alternate embodiments the load portmay have more or fewer sections) each capable of interfacing a carrier100 to the FEM. In alternate embodiments, a load port section may beconfigured to interface more or fewer carriers to the FEM. In theexemplary embodiment, the load port sections 10A-10C and correspondinginterfaces 11A-11C may be substantially similar. Each load port section10A-10C and corresponding interface 11A-11C may be independently andsimultaneously operable providing substantially unrestricted FEM access,for wafer transfer, and substantially random access by an automatedmaterial handling system (AMHS) (not shown) to undocked carriers on theload port sections. In alternate embodiments, the load port may have anyother desired configuration. The substrates handled by the carriers andload port may be of any desired type such as semiconductor wafers of anydesired size, such as 450 mm, 300 mm, or 200 mm diameter reticles orpelicles, or flat panels for flat displays.

Referring now to FIG. 3, there is shown another schematic elevation viewof a carrier 100. In the exemplary embodiment illustrated in FIG. 3, thecarrier 100 is resting on load portion section 10A. The carrier 100shown in the figures is representative, and in alternate embodiments,the carrier may have any other suitable features. In the exemplaryembodiment the carrier generally comprises a shell 102 defining thechamber enclosing the substrates (see also FIG. 8). The shell may bemade of non metallic material, such as optically clear thermoplastic,polyvinylidine chloride (PVDC), composites or non magnetic metal such asaluminum alloy, magnesium alloys and metallized plastics with forexample one or more viewing ports, sealed with an optically clearmaterial (e.g. the viewing ports may be positioned to allow wafermapping, through the window with beam sensors outside the carrier shell.In alternate embodiments the shell may be made of any suitable materialcapable of maintaining a sealed environment within the carrier. As seenbest in FIG. 8, the carrier shell defines a substrate transfer openingin a side of the shell that is closable by door 104 as will be describedfurther below. The carrier 110 may have couplings or attachments 110,112 for handling the carrier and positioning the carrier, such as at theload port interface. In the exemplary embodiment, carrier 100 may have ahandle or flange 112 for automated gripping of the carrier from the topsuch as with the AMHS. In alternate embodiments, the top handle 112 maybe employed to engage the carrier to the load port interface (see forexample FIGS. 7A-7C). In other alternate embodiments, the carrier mayhave any other desirable handling features on the shell. In theexemplary embodiment, the carrier shell may have a carrier positioningcoupling 110, capable of providing repeatable positioning of the carriersuch as on the load port interface. For example, the coupling 110 may bea kinematic coupling (e.g. provides substantially automatic repeatablepositioning) located on the bottom mating surface of the carrier such ashaving features substantially in accordance with SEMI E 57.1. In theexemplary embodiment, the coupling between carrier and load portinterface with coupling 110 may be relaxed as will be described furtherbelow, to eliminate overconstraints in registration of the carrier tothe load port interface and ensure desired registration between carrierflange and load port interface flange. In alternate embodiments, thecarrier mating surface and registration coupling may be positioned onany other side of the carrier. As seen in FIG. 3, in the exemplaryembodiment, the carrier 100 may interface the load port at interface 110and at interface 101, which if provided in a conventional configurationmay generate an overconstrained condition for conventional carrierregistration on the load port due to competing interface surfaces of thedifferent interfaces. In the exemplary embodiment, the carrier 100 mayinterface the load port at interface 110 and at interface 101 withoutgenerating an over constrained condition, as will be described furtherbelow.

As seen in FIG. 3 and as noted before, in the exemplary embodiment thecarrier shell 102 and door 104 mate/interface at interface 103 (shownschematically in FIG. 3) to close the carrier chamber. In the exemplaryembodiment, the interface 103 may be sealed with seal 103S, and a doorlatch 106 may hold the door to the shell when closed. As also seen inFIG. 3 and noted before, the door 104 in the exemplary embodiment mayalso define at least a portion of the interface 105 to the load portdoor 12. Hence, in the exemplary embodiment the carrier door 104 mayhave interface features for interfacing with both the carrier shell (atinterface 103) and the load port door (at interface 105), and thusgenerating a further competing interface and possible constraint onregistration of the carrier at the load port (e.g. in addition tointerfaces 110, and interface 101 which as noted before is definedbetween carrier shell flange and load port flange). In the exemplaryembodiment shown in FIG. 3, the carrier shell to door interface 103 maybe compliant thus positionally releasing the carrier door relative tothe shell when the carrier door interfaces the load port door (thuseliminating the constraint due to interfacing the carrier door to boththe carrier shell and load port door). Compliance at interface 103 maybe effected such as with a suitably compliant seal 103S capable ofaccommodating and compensating for any mismatches in mating surface ofdoor and shell (to ensure interior cleanliness is not compromised andwithstand desired pressure differences between carrier chamber andexterior atmosphere). The door latch 106 may be configured to generatesufficient latching forces to withstand any bias against the door suchas from seal compression, pressure differential across door andsubstrate bias against the door as will be described further below. Thedoor latch 106 may be substantially solid state device (e.g. latchingactuation is effected by non-contact methods) to avoid particulategeneration. The compliant seal 103S may be incorporated within thelatching device so that flexure of compliance of the seal effectslatching, and/or the latching device 106 may be integrated into theseal. By way of example, as shown schematically in FIG. 3, seal 103S maybe a combination seal and magnet. Seal 103S may be a face seal disposedaround the perimeter of the door, with a magnetic ribbon located on thedoor within the seal, operating on magnetic material in the shell flangeto compress the seal. In alternate embodiments, a radial or curved (e.g.seal surface cross section) door seal may be used at the shell tocarrier door interface. In other alternate embodiments, the seal mayhave any other desired configuration.

In the exemplary embodiment, the latch device 105 in the carrier may bepassive, and actuation (to open/close the latch) may be effected by anactive side that may be resident for example in the load port. Inalternate embodiments, the active side of the latching device may beresident in the carrier 100. As may be realized, to effect actuation ofthe latching device demands that power and control be provided to thedevice. Locating the active portion of the device in the load port, forexample, may avoid or minimize power and control demands of the carrier.In the exemplary embodiment shown in FIG. 3, energy transfer to drivethe passive section of the latch may be magnetic, such as with anelectromagnet (for example position in the load port door) that whenenergized generates a magnetic field sufficient to decouple thepermanent magnet on the carrier door from the magnetic material in theshell 102. In other exemplary embodiments, the energy transfer to thelatching device may be effected by induction, or electrical contact padsbetween carrier 100 and load port 10A. In other alternate embodiments,actuation energy may be stored on the carrier 100 and control commandsmay be transmitted wirelessly to the carrier 100 for operating thelatch. In the exemplary embodiment, actuation input for actuating thelatch 106 may be applied via the carrier door 104, though in alternateembodiments actuation input may be applied to the carrier shell. FIGS.3A-3E are partial cross sectional views of the carrier shell to doorinterface 105 and door latch in accordance with different exemplaryembodiments. In the exemplary embodiments shown the door latch actuationis magnetic, and the active portion of the device is shown for examplein load port door 12. Accordingly, in the exemplary embodiments shownactuation of the active part effects actuation of the shell or carrierto door latch 106 in combination with actuation of the carrier door toload port door latch 106D. As may be realized, the latch configurationsshown in FIGS. 3A-3E are merely exemplary, and in alternate embodimentsthe carrier door latch (both to the shell and load port door) may haveany other desired configuration. In the exemplary embodiment shown inFIG. 3A, the magnetic latch may include permanent magnets 9050 in thecarrier door operating on ferrous materials 9051 in the carrier shell.In alternate embodiments, the permanent magnets may be in the shell andmagnetic material in the carrier door. The configuration for example mayeffect a closed magnetic circuit when the carrier door latch is closed(active portion is off), thus minimizing the potential of stray magneticfields. As can also be seen in FIG. 3K, in the exemplary embodiment aferrous material 9050A may also partially surround the permanent magnets9050. This ferrous material may be configured to form what may referredto as a shield around the magnets prevent or minimize stray magneticwithin the carrier as well as exterior to the carrier is desired. ThoughFIG. 3K illustrates the ferrous shield 9050A used with the latch magnetarrangement as in FIG. 3A, the ferrous shield may be used to shield thelatch magnets having any other desired configuration, such as shown inFIGS. 3B-3H and 3K-3L. The configuration of the ferrous shield (andmagnets) shown in FIG. 3K is illustrated schematically and in alternateembodiments the ferrous shield 9050A (and magnets) may have any suitableconfiguration in relation to the latch magnets that may prevent orminimize stray magnetic fields from the interior and exterior of thecarrier. It is noted that the magnets 9050 and/or ferrousmaterial/plates 9051, 9050A may be embedded in other non-ferrousmaterials or coated for corrosion resistance.

In the exemplary embodiments, the active portion may be an electromagnet9052, which may be positioned in the load port door for example as shownin the figures. When the active portion is actuated (e.g. turned “on”)actuative forces between the permanent magnets 9050 in the carrier door104 and magnetic material 9051 in the shell 102 are overcome by theeffects of the magnetic field from the electromagnets 9052 in the loadport door 12, releasing the carrier door/shell latch 106 and closing thecarrier door to load port door latch 106D. As may be realized, thecarrier door 104 may be moved with the load port door 12, such as whenthe load port is opened, and hence moving the permanent magnets 9050 inthe carrier door which when in the latch open position may define anopen magnetic circuit away from the substrate transport opening in theload port (for example to minimize undesired magnetic fields). As can beseen in FIG. 3B, in accordance with another exemplary embodiment, thecarrier door 104 may include permanent magnet 9050 connected to one sideof a flexure 9060 and a ferrous material 9050D connected to the otherside of the flexure 9060. The flexure 9060 may be made of any suitableresiliently flexible material(s). When the electromagnet 9052 isactivated it may interact with the ferrous material 9051D to move theflexure causing a displacement of the permanent magnet 9050 relative tothe ferrous material 9051 in the door (e.g. releasing the carrierdoor/carrier shell latch and causing latching between the carrier doorand load port door). In the example shown in FIG. 3C, the permanentmagnet 9050 in the carrier door 104 may be rotatable such that when theelectromagnet 9052 is activated the permanent magnets 9050 rotate sothat the interaction of the ferrous material 9051, permanent magnets9050 and electromagnet 9052 is such that carrier door/carrier shelllatch 106 is released and the load port door/carrier door latch 106D isengaged. In the exemplary embodiments illustrated in FIGS. 3D-3E, thelatch portion in the carrier door may be an induction electromagnet9050′, 9050″ with active coil 9052′ located in the port door 12 toactivate the induction electromagnets and thus latch/unlatch the carrierdoor from the carrier shell. As can also be seen in FIG. 3E, the carriershell, in an exemplary embodiment, may include permanent magnets 9051′to interact with the induction electromagnet 9050″. The inductionelectromagnet arrangements in FIGS. 3D-3E may operate in a substantiallysimilar manner as that described above with respect to FIGS. 3A-3B. Theconfiguration of the induction electromagnets, as well as of the passiveand active elements illustrated in FIGS. 3A-3E are merely exemplary andin alternate embodiments the passive and active elements of the solidstate (or near solid state) latches between the carrier shell and door,and carrier door and port door may have any other suitable configurationand may comprise more or fewer elements.

Referring to FIG. 3L, in other exemplary embodiments, the magnetic latchbetween the carrier and door may be unlatched mechanically. For example,the magnetic latch/seal shown in FIG. 3L may include magnets 9090 andmagnetic (e.g. ferrous) material 9091 respectively located in the door104 and carrier shell 102, for example, in a generally similararrangement to that shown in FIGS. 3A-2C through in alternateembodiments the latch may have any other desired configuration. Themagnetic latch/seal may be released mechanically through, for example,the activation of the latch finger 9092. The latch finger 9092 may bepivotally mounted at least partially in the door 104 about a pivot 9093.The latch finger 9092 may be operably coupled to, for example, a movablelatch key hole 9094 of the door 104 (shown, for example, as beingrotatable, though it may be movable in any other desired manner, such astranslation). The key hole may be engaged and moved by keys, such asfrom the load port door. In the exemplary embodiment shown, as the latchkey 9094 is rotated in the direction of arrow 9095 the latch members orfingers are caused to pivot in the direction of arrow 9096 to, forexample, urge the door 104 away from the carrier shell 102 therebyreleasing the magnetic latch. It is noted that the configuration shownin the figure is exemplary only and in alternate embodiments themagnetic latch/seal between the door and carrier may be mechanicallyreleased in any suitable manner. For example, the magnets or magneticmaterial may be mounted or linked to the latch fingers so that movementof the latch fingers moves the magnets/magnetic material of the carrierdoor latch away from each other to release the latch. Conversely,engagement of the latch may be effected by reverse movement of the latchfingers.

Referring now to FIG. 3F there is shown other schematic partialcross-sectional views of the carrier shell and door interface and latch106 in accordance with another exemplary embodiment. In the exemplaryembodiment shown, latching is effected by some positive displacement(such as with a flexible member or piezo-electric effect) betweencarrier shell 102 and carrier door 104 along the interface generatingsubstantially an interference compression therebetween substantiallyaround the interface perimeter. The interference between carrier shell102 and door 104 may be positioned to cooperate with bias forces forexample on the carrier door 104 (such as from pressure differentialacross the door) and increase the compression and hence latching forcesbetween the shell 102 and carrier door 104. The displacement section maybe positioned in the carrier shell 102, carrier door 104 or both. Torelease the latch 106, the displacement section may be actuated torelease compression on the carrier door 104. In the exemplaryembodiment, the displacement section may have a flexure member 9099 thatmay be actuated to effect latching and unlatching. Actuation of theflexure member 9099 may be for example by vacuum (e.g. vacuum bladder),by magnetics, electroactive polymers, shape memory alloys (SMA) or anyother suitable actuation means.

Referring to FIGS. 3I and 3J examples of SMA members are shown that maybe used to actuate the, for example the flexure member 9099 or similarlatching member. As may be realized, though SMA has memory, it does notstore energy. In the exemplary embodiments, the SMA may be however aneffective solid state actuator. In the exemplary embodiments, the latchmechanism may be normally biased to a closed position such as bymaterial flexure, spring, magnetic input, and the SMA member (or wire(which may be integrated into the carrier) pre-stressed by the closingbias may be actuated, such as via electrical or heat input from the loadport, to overcome the closing bias and displace the flexure member toopen the latch. In one exemplary embodiment as shown in FIG. 3I the SMAmember such as wire 10200 may be connected to a latch which is normallybiased to the “latched” state. This type of latch could be a pivotallymounted finger 106′ which rotates in either a horizontal or verticalplane. In an alternate embodiment, the pivot could be replaced with aflexure. In another exemplary embodiment, as shown in FIG. 3J a gasket10201 with sufficient elasticity to pre-stress the SMA member(s) 10200′may be used which may be collapsed by the SMA member(s) 10200′ atactuation. A variation on the collapsible gasket would employ a wipertype gasket which is deflected by the SMA member pulling on the tip ofthe wiper. The bent wiper creates enough separation for the door to bereleased and removed.

In other examples, a vacuum (e.g. bladder actuator) for example, havinga configuration similar to actuator 5000 in the exemplary embodimentsshown in FIGS. 19 and 20 may be used to actuate a latching membersimilar to flexure member 9099. The bladder actuator similar to actuator5000 may be configured to actuate the flexure member 9099 (see FIG. 3F),or any other suitable actuable mechanism or device (see also FIGS.3A-3L) of, for example, the processing tool and carriers including, butnot limited to, load port or substrate carrier doors, gate valves, andlatches. In this example the actuator 5000 is configured generally as avacuum or partial vacuum bladder. In alternate embodiments, the actuatormay have any other suitable configuration. The actuator 5000 may beconfigured to minimize the overall size of the actuator 5000 withrespect to the stroke of the actuator 5000 (e.g. maximize the stroke tosize ratio of the actuator). In the exemplary embodiment, the actuator5000 may be controlled to operate inside a controlled clean environmentsuch as inside a carrier or inside a process tool. In the exemplaryembodiment shown, the actuator may generally have a base orsubstantially fixed surface 5020, a moveable surface 5030 and a power ordrive surface 5035 capable of effecting movement of the moveable surface5030 and hence actuating the actuator 5000. As can be seen in theFigure, the fixed surface may have a seal 5010 for sealing the actuatoragainst any suitable surface so that, for example, a pressuredifferential may be created on either side of the actuator. In theexemplary embodiment the power surface 5035 is shown and referred to asa bladder for example purposes only, and in alternate embodiments thepower surface 5035 may have any other suitable shape or configuration.As may be realized, the fixed surface 5020, shown illustratively inFIGS. 19-20, may be mated to a fixed surface or member of the tool orcarrier frame, and the moveable or actuator surface 5030 may beconnected to the actuated mechanism so that movement of the movablesurface, under the impetus of a pressure differential (e.g. thedifference in pressure between pressure P1 and pressure P2 located onopposite sides of the drive surface 5035) across the drive surface 5035causes actuation of the mechanism. In the exemplary embodiment the drivesurface 5035 may be shaped to form an inner space or volume 5002 and mayform an isolation boundary or membrane substantially isolating theinterior space 5002 bounded thereby, and any moving components locatedtherein such as described further below for example, from the spaceoutside the drive surface 5035. The drive surface may be made from anysuitable material to eliminate or minimize particulate formation whenthe drive surface 5035 moves during actuation. In the exemplaryembodiment, the drive surface 5035 is connected to the fixed surface5020 of the actuator 5000 and to the moveable surface 5030 of theactuator, and a portion of the drive surface 5035 is arranged (as shownin FIGS. 19-20 for example, though in alternate embodiments there may beany other surface arrangement) to move relative to the fixed surface5020 when subjected to a desired pressure difference across the drivesurface 5035. The degrees of freedom and rate of actuation may becontrolled as described further below, and may be achieved if desiredwithout use of electronic control or electrical power.

As noted before, the activation of the actuator 5000 (e.g. extension andretraction) may be controlled through, for example, the pressuredifference on the bladder of the actuator and the rate of actuation maybe controlled by the size of 5000 orifices in flow lines 5055 or leakpoints 5056 located through the drive surface 5035 around the actuator5000, for example purposes. The location of the of the leak points 5056and flow lines 5055 are exemplary only and in alternate embodiments theflow lines and leak points may have any suitable location on or relativeto the actuator. The orifices may be connected to, for example anysuitable atmosphere of the processing tool 2 (or external environmentsuch as the ambient environment around the tool) and may be in flowcommunication with an internal volume of the actuator. In one example,the differential pressures P1, P2 between a vacuum environment andatmospheric environment of the processing tool 2 provides, for example,linear motion of the vacuum actuator 5000. For example, the outside ofthe bladder 5001 may be exposed to a vacuum environment of theprocessing tool while the inside 5002 of the bladder is exposed to anatmospheric environment of the processing tool 2. For example, as can beseen in FIG. 20, for exemplary purposes only, the vacuum environment maybe provided by the flow lines 5055 (e.g. the flow lines may causepumping down of a chamber in communication with the drive surface 5035as will be described below). As may be realized, as the vacuum pressureincreases the differential pressure P1, P2 between the vacuum andatmopsheric pressures increases causing actuation of the actuator (andvice versa). In other embodiments one side the actuator may bepressurized, as will be described below, for moving the actuator. Inalternate embodiments the outside 5001 of the bladder may be exposed tothe atmospheric environment while the inside of the bladder 5002 may beexposed to the vacuum environment. In one exemplary embodiment, anysuitable filters may be placed in the orifice(s) and/or at the leakpoint(s) to prevent or minimize any particles generated within theactuator 5000 from entering, for example, the load lock or any othersuitable controlled clean environment. In alternate embodiments, theactuator 5000 may have its own pumping system for inflating anddeflating the bladder for actuating the actuator 5000. The speed (e.g.acceleration and deceleration) at which the actuator 5000 is activatedmay be controlled in any suitable manner such as by, for example,orifice restrictions that may be fixed or variable, including but notlimited to valves, in the flow lines and/or in the leak points aroundthe actuator 5000.

In one exemplary embodiment, the extension and retraction of theactuator 5000 may be guided to fix a predetermined number of degrees offreedom movement of the actuator 5000. For example, as can best be seenin FIG. 20, the actuator 5000 may be configured so that it extends andretracts linearly in substantially the direction of arrow 5050 whilemovement of the actuator in other directions (e.g. linear androtational) such as those indicated by arrows 5040-5042 are restricted.In alternate embodiments the actuator 5000 may have any suitable numberof degrees of freedom for actuation in any one or more directions. Inthis example, the actuator 5000 may include any suitable linkage(s) 5005for guiding the movement of the actuator 5000. Here the linkage may be a“scissor” or “accordion” linkage but in alternate embodiments thelinkage may have any suitable configuration. The scissor or accordionlinkage may provide a compact profile when retracted or folded whilemaximizing the extension or reach of the linkage when in an unfoldedconfiguration (e.g. maximize a containment to reach ratio of theactuator). In alternate embodiments, the linkage may include extendablerails where one or more rails are connected in series and configuredwith different widths and heights so that the smaller rails slide intolarger rails in the series of rails providing a telescoping extensionand retraction of the rails. In other alternate embodiments, the bladdermay be constructed of a self guiding material such as, for example, amesh material that is constructed so that as the drive surface is movedvia the pressure differential the mesh guides, for example, the linearmovement of the actuator 5000. In still other alternate embodiments themovement of the actuator may be guided in any suitable manner.

Here the linkage 5005 is located inside 5002 the bladder so that anyparticulate generated by the linkage is not exposed to the vacuum orotherwise clean environment within the processing tool. In alternateembodiments the linkage may be located outside the bladder. In stillother alternate embodiments the particulate that may be generated by thelinkage may be contained in any suitable manner. While the actuator isdescribed as being a linear actuator in alternate embodiments theactuator can be configured for rotary actuation. In still otherembodiments the linear motion of the actuator may be converted intorotary motion in any suitable manner. In still other alternateembodiments the actuator may include two bladders connected to a commonactuator chamber for providing two degrees of motion having any spatialrelationship to each other. For example, one of the bladders may beconfigured to move a door substantially perpendicular relative to a doorinterface surface of a substrate passage opening while the secondbladder is configured to move the door substantially parallel to thedoor interface surface so that the substrate passage opening inunobstructed by the door. The multiple bladders may be constructed withdifferent properties, including material and thickness of the bladdermaterial, so that the bladders may be actuated at different timesdepending on a predetermined actuation pressure differential of each ofthe bladders. As may be realized, the bladders described herein may beconfigured in any suitable orientation and may be arranged in parallelor in series with respect to one another to provide a desired actuation.

Referring now to FIGS. 3G-3H are schematic partial cross-sectional viewsof the carrier shell to door interface and latch respectively showingexemplary configurations of a displacement type latch in accordance withdifferent exemplary embodiments. In the example shown in FIG. 3G thelatch includes ferrous material 10001 located in the carrier shell 102and a permanent magnet 10002 in the carrier door 104. A flexiblematerial or gasket 10003 may be attached to the carrier door 104 suchthat it encloses magnet 10002 within the door 104. An actuator 10005,for example, similar to actuator 5000 described before or otherpreviously described actuators, may be located in the door 104 whichwhen actuated pulls the magnet 10002 away from the ferrous material10001, overcoming the magnetic force therebetween and releasing the door104 from the carrier shell 102. In the example shown in FIG. 3H thelatch includes, for example, a rotatable ring shaped multipole magnet10100 in the carrier shell 102 and a stationary multipole ring shapedmagnet 10102 in the carrier door 104. The shape of the magnets 10100,10102 is merely exemplary and the magnets may have any other suitableshape for operating as described herein. In alternate embodiments themagnet in the door 104 may be rotatable and the magnet in the carriershell 102 may be fixed. In still other alternate embodiments the magnetsmay be movable in any suitable manner for operating as described herein.To release the latch, a handle 10101 connected to the rotatable magnet10100 may be turned causing the magnet 10100 to rotate such that thepoles on the magnets 10100, 10102 repel each other causing the latch torelease. In alternate embodiments the magnet 10100 may be moved in anysuitable manner such as manually or through automation such as asolenoid, spring, coil, latch key similar to latch key hole illustratedin FIG. 3L, or other suitable device. In alternate embodiments, thelatch may have any other desired configuration.

Referring now to FIGS. 4A-4E, the carrier 100 is shown in differentpositions as it is being mated to the load port interface 10. Referringalso to FIG. 4F, there is shown a flow chart graphically illustrating aprocess for mating the carrier with the load port interface inaccordance with the exemplary embodiment. The positions and processdepicted in FIGS. 4A-4F are exemplary, and in alternate embodiments thecarrier may be interfaced with load port in any other desired process.In the embodiment shown in FIG. 4A, the carrier 100 is positioned at adistance from the load port interface, for example such as when thecarrier arrives at the process tool (FIG. 4F, Ref. 10600). The carriermay be handled for example by an AMHS (not shown) supporting the carrierfrom the upper handle 112, though in alternate embodiments the carriermay be handled in any other desired manner. As may be realized, in theposition illustrated in FIG. 4A, the carrier chamber is closed, as isthe load port. In FIG. 4B, the carrier 100 may be initially registeredto the load port (FIG. 4F, Ref. 10601). By way of example registrationcoupling portion 110 (in the exemplary embodiment on the bottom matingsurface) of the carrier engages complementing registration couplingportion 20 of the load port 10. In this position, the side interface ofthe carrier is at a distance from and not mated to the load port flange10500. Referring again to FIG. 3, in the exemplary embodiment thekinematic coupling features 110 and the registration reference datum orplane of the carrier defined thereby may be positioned near thesubstrate seating planes or midplane of the carriers, hence reducing anyangular misalignment effects between constraining interfaces. In theposition shown in FIG. 4B, the carrier may be clamped relative to theload port interface 20A to hold the carrier in position as the load portshuttle advances the carrier (FIG. 4F, Ref. 10602) to coarsely couplethe carrier shell flange 10501 to the load port flange 10500 atinterface 101 (shown in FIG. 4C) (FIG. 4F, Ref. 10603). In the exemplaryembodiment, the carrier flange 10501 and the load port flange 10500 mayinclude for example kinematic coupling features defining repeatableregistration datum at interface 101 (as will be described further below,see also FIG. 8). As noted before, repeatable registration of carrier toload port flange at interface allows establishment and opening of theclean tunnel from the carrier chamber through into the FEM withoutcompromise of the process atmosphere. By way of example, in the coarselycoupled position, see FIG. 4C, the carrier door 104 may be interfacedwith the load port door 12. As may be realized, the compliant interface103 between carrier shell and door may accommodate positionaldifferences arising on carrier registration at interface 110 and matingof the carrier door and load port door at interface 105, hence allowinginterface 105 to be closed and the carrier door clamped to the load portdoor (FIG. 4F, Ref. 10604). In the exemplary embodiment, the load portdoor may have a vacuum port to purge any volume of interface 105, priorto clamping carrier door to load port door, though in alternateembodiments the interface 105 may have substantially no volume. In theexemplary embodiment, the carrier door 104 may be clamped to the loadport door 12, for example with latching devices such as previouslydescribed, that may effect carrier door to load port door clampingsubstantially simultaneously with latch release between carrier shelland door. In alternate embodiments, independent clamps may be used tosecure carrier door and load port door. In other alternate embodiments,vacuum clamping such as via vacuum bellows acting on the whole carrier.The carrier door surface or local vacuum cups may clamp carrier door toload port door and assist carrier door decoupling from the carriershell. In FIG. 4A, the load port door is shown retracting and moving thecarrier door through the load port into the FEM as will be describedfurther below. In the exemplary embodiment shown in FIG. 4D, theregistration between carrier shell and load port at interface 110 may berelaxed. For example, any hold down clamp holding the carrier shell inthe registered position may be released, and the kinematic coupling 110,20 may decouple, at least in part, by lowering coupling pins 20A fromthe grooves, or by lifting the mating surface (FIG. 4F, Ref. 10605). Asthe registration at interface 110 may be relaxed, the registrationcoupling features at interface 101 (between shell flange and load portflange) may be engaged registering the shell 102 to the load port flange10500 (FIG. 4F, Ref. 10607). In the exemplary embodiment, the actuationinput for registration at interface 101 (and relaxation of registrationat interface 110) may be the retraction of the load port door. By way ofexample, coarse coupling of the kinematic coupling features (e.g.partial engagement) at interface 101, and relaxation of registration atinterface may positionally suspend the carrier in such a manner thatminor tugging forces, as may be generated by the carrier door on thecarrier shell as the door is retracted may be sufficient to drive thecarrier shell to complete engagement of the kinematic coupling featuresat interface 101, resulting in full registration. Full registration atinterface 101 may be effected by actuating the clamps (not shown),clamping the carrier shell to load port flange (in yaw and pitch asschematically illustrated in FIGS. 5A-B). In the registered positions atinterface 101. The carrier and load port door 104, 12 may be lowered asshown in FIG. 4E (FIG. 4F, Ref. 10608).

Referring now to FIG. 8-8A, there is shown respectively a schematicperspective view and a side elevation view of the carrier 100 inaccordance with another exemplary embodiment. As noted before, and seenbest in FIG. 8A, the carrier shell may have a mating flange withcoupling features that define coupling portion 101B of interface 101(between shell flange 102F and load port flange 14, see also FIG. 3).Referring now to FIG. 9A, there is shown a schematic partial perspectiveview of the mating of load port flange 14 to the carrier shell flange102F at load port flange interface 101, in accordance with anotherexemplary embodiment. The configurations of the interfaces shown in thefigures are exemplary, and in alternate embodiments the carrier flangeto load port interface may have any other desired configuration. In theexemplary embodiment illustrated in FIG. 9A, the load port flange 14 maybe disposed on a frame member or bulkhead that defines the load ports ofthe load port sections. Interface seals may be provided around the loadports 16A-16C to seal the interface when closed, and a clamping device(shown for example as magnetic clamp pads 10700) may be located toengage the carrier shell 102 and hold the carrier shell 102 on the loadport. In alternate embodiments, the interface seal and clamp device mayhave any desired configuration such as, for example, vacuum clamping. Inthe exemplary embodiment shown in FIG. 9A, the load port flange 14 mayhave coupling features defining complementing coupling portion 101A ofinterface 101. In the exemplary embodiment, the respective couplingfeatures 101A, 101B define a kinematic coupling, for repeatableregistration of carrier shell(s) 102 to the load port at interface 101.As noted before, the features of the kinematic coupling 101 shown inFIGS. 8, 8A and 9A-9C and 10 are merely exemplary and in alternateembodiments the kinematic coupling may have any other suitableconfiguration. In the exemplary embodiment, the kinematic coupling 101comprises pins 22, 24 (coupling portion 101A) on the load port flange14, and grooves or detents 122, 124 (coupling portion 101B) on thecarrier shell flange 102F. In the pins 22, 24 and grooves 122, 124 maybe arranged to repeatably position the carrier shell 102 relative to theload port in the x, y, z directions and allow the carrier shell 102freedom to pitch and yaw when translated to interface 101 (see FIGS. 4Cand 5A) to overcome slope differences between shell flange 102F and loadport flange 14 (illustrated for example in FIG. 5A) to seat theinterface seal. For example, the pins and grooves may be locatedsubstantially at the midplane of the carrier shell 102 and load port16A-16C. The coupling may be arranged as shown for example, so that uponcoarse coupling between carrier shell 102 and load port 16A-16C atinterface 101, the coupling provides sufficient Z support to allowrelaxation of the constraints from kinematic coupling 110 such as bydecoupling the coupling pins 20A of coupling 110. Decoupling of thecoupling 110 may be assisted by Z′ motion (e.g. via shuttle or othersuitable lifting mechanism) of the carrier to transfer Z loading ontothe coupling pins 22, 24 and decouple coupling pins 20A. FIG. 10 is aschematic plan view showing the carrier in a mated position at interface101.

Referring now to FIGS. 21-25, one example of transferring a registrationof the carrier from kinematic coupling 110 to interface 101 without overconstraining the object 6000 will be described in greater detail inaccordance with one exemplary embodiment. As can be seen in FIG. 21 anobject 6000 is shown located on a coupling plate 6010 of, for example, aload port 6099. The object 6000 may be representative of carrier 100 butin alternate embodiments the object 100 may be any suitable object. Thecoupling plate 6010 may include kinematic couplings 6030 for couplingthe object 6000 to the plate 6010. The kinematic couplings 6030 may besubstantially similar that described above with respect to FIG. 3. Forexample, as can be seen in FIGS. 21A, 21B the carrier 100 may includesubstantially V-shaped grooves 6032A-6032C (generally referred to asgroove(s) 6032) that are configured to interface with pins 6031A-3031C(generally referred to as pin(s) 6031) of the coupling plate 6010. Inalternate embodiments the kinematic coupling may have any other suitablearrangement, such as pins in the carrier and grooves in the couplingplate or any other desired combination of pins, grooves or othersuitable kinematic coupling features. As can be seen best in FIG. 21B,in the exemplary embodiment, the pin 6031 may have a curved interfacesurface and is suitably shaped to fit at least partly within theV-shaped groove 6032 for locating the carrier 100 with respect to theload port 6099. In alternate embodiments the pins and grooves may haveany suitable configurations. The coupling may be in accordance with SEMI(Semiconductor Equipment and Materials International) standard E57-0600.In alternate embodiments the kinematic coupling may be any suitablekinematic coupling.

Referring back to FIG. 21, the load port 6099 may include any suitableactuator 6020 for moving the object 6000 towards and away from interface6013 for coupling and decoupling the object 6000 to and from theinterface 6013. In one embodiment the interface 6013 may besubstantially similar to interface 101 and include any suitablekinematic coupling. In alternate embodiments interface may be anysuitable interface having any suitable coupling features for couplingthe object 6000 to the interface 6013. Referring to FIG. 22, in oneexample, the interface 6013 includes a kinematic surface 6050, which maybe in a coupling plane oriented at an angle relative to the plane of thecoupling or plate 6010 (the coupling plane is shown as beingsubstantially perpendicular to the coupling plane of plate 6010 forexemplary purposes). In alternate embodiments the kinematic surface 6050may have any suitable angular relationship with respect to the couplingplate 6010.

The interface 6013 may be suitably located on the kinematic surface andinclude, for example, kinematic coupling features 6035, preloading 6060for at least partially securing the object 6000 to the interface 6013, aport door and suitable seals for sealing off the environment within thecarrier (and within the chamber of the tool component the objet isinterface with) from an external atmosphere. It is noted that theinterface 6013 may include latches for securing the object 6000 to theinterface 6013 as described above with respect to FIGS. 3A-3I. Thelatches may work in conjunction with for example, the preloading 6060for securing the object 6000 to the interface 6013. In this example thepreloading 6060 may be vacuum preloading but in alternate embodimentsthe preloading may be any suitable preloading including, but not limitedto magnetic or mechanical preloading. Suitable examples of preloadinginclude those described below with respect to FIGS. 12-12B.

The kinematic coupling features may be any suitable kinematic couplingsincluding, but not limited to, kinematic pins 6035 as shown in FIGS.21-23. In this example, there two pins located on opposite sides of theinterface 6013 but in alternate embodiments there may be any suitablenumber of pins located in any suitable position around the interface.The object 6000 may have corresponding recesses or apertures 6001 forinterfacing with the pins 6035 as can be seen in FIG. 23 (see also FIG.22A). The pins 6035 and recesses 6001 may be configured to stably holdand locate the object 6000 on the kinematic surface 6050 inpredetermined relation with respect to interface 6013. The kinematiccoupling 6035, 6001 causes repetitive location of the object(s) 6000relative to the interface and may stably hold the object(s) 6000 coupledto the interface without the preload system 6060 if desired.

Referring now to FIGS. 22A and 22B the interface (e.g. pins andrecesses) between the object 6000 and kinematic surface 6050 is shown ingreater detail. As may be realized the configuration of the pins andrecesses shown in FIGS. 22A, 22B are for exemplary purposes only and inalternate embodiments the pins and recesses may have any suitableconfiguration. In this example, the object 6000 may have an interfacesurface or face 22000 including recesses 6001A, 6001B substantiallycomplementing pins 6035 to define in combination the kinematic couplingof interface 6013. The recess 6001A may be configured as having asubstantially cone shape with for example, a pilot hole (definesZ-position). The recess 6001B may be in the form of a slot, such as asubstantially V-shaped groove having, for example a pilot slot (definesY-position). The pins 6035 (which may be same on both sides of the loadport) include a kinematic coupling lead pin 6035B (provides with slot6001B freedom of movement in X, Z directions) and a kinematic component6035A that provide freedom of movement along the X axis as shown in FIG.22B (restrained in Y and Z axes). In this example the kinematiccomponent 6035A of pin 6035 is shown as having a substantially sphericalshape, but in alternate embodiments the kinematic component may have anysuitable shape including a substantial V-shape. The interface may alsooptionally include mechanical sensing pins, to for example sense theobject 6000 and its alignment relative to interface 6013 as it iscoupled to the kinematic surface 6050. In this example, the lead pin6035B may engage the pilot hole of recess 6001A while kinematiccomponent 6035A engages the cone shape of the recess 6001A for locatingthe object (generally similar to that shown in FIG. 9B). The recess6001B may provide compliance for engaging the pin(s) on the other sideof load port via the slot/groove while still providing movement only inthe X-direction. For example, lead pin 6035B may engage the pilot slotwhile kinematic component 6035A engages the V-shaped groove of therecess 6001B (generally similar to that shown in FIG. 9C).

Still referring to FIG. 23 the object 6000 may be transported oradvanced towards the interface 6013 by the actuator 6020. The object6000 and the coupling plate 6010 may both be advanced or moved towardsthe interface 6013 where the movement of the object 6000 is arrestedthrough, for example contact with the interface 6013 while the couplingplate 6010 continues to advance. In alternate embodiments the pins 6031may be moveable relative to the coupling plate 6010 so that the pins6031 advance with the object 6000 while the coupling plate is arrestedat a predetermined distance. For example the pins may be located on asub plate that is moveable relative to the coupling plate 6010 andextend through slots on the coupling plate 6010. In alternateembodiments relative movement between the object 6000 and the pins 6031may be provided in any suitable manner so that the object 6000 engagesthe interface 6013 and is substantially lifted off of the pins 6031.

Advancement of the coupling plate 6010 past the point of engagementbetween the object 6000 and the interface 6013 causes relative movementbetween the object 6000 (and its grooves 6032) and the pins 6031 (asshown in FIG. 24 as arrows 6033 and 6034, for example) causing theobject to ride up on the kinematic pins 6031 as the kinematic pins 6031are advanced in the direction of arrow 6033 further towards theinterface. For example, referring also to FIG. 24 the pin(s) 6031 whenmoved relative to the V-shaped groove(s) 6032 causes the object 6000 tobe lifted from the coupling plate 6010 for engaging the kinematic pins6035 of interface 6013 forming gap 6070 between the coupling plate andthe object. The V-shaped grooves 6032 may be oriented so that both alifting and guiding force (e.g. a force substantially parallel with thecoupling plate 6010) is generated by the relative movement between thegrooves 6032 and the pins 6031. The guiding force may act to hold a pathof movement 6089 of the object 6000 along a centerline CL relative tothe pins 6031 as the object is lifted off of the coupling plate 6010(see FIG. 21A) and advanced to engage the interface 6013. In alternateembodiments, any suitable forces may be generated through the contactbetween the pins 6031 and grooves 6032 for guiding the object 6000towards the interface 6013.

The interface between the pins 6031 and the grooves 6032 may beconfigured to allow for the lifting of the object 6000 while allowingthe object 6000 to pivot and move so that the object 6000 is not overconstrained when the object 6000 is mated to the interface 6013.Referring to FIG. 25 the relationship between the pin 6031 and theV-shaped groove 6032 is shown when the object 6000 is coupled to theinterface 6013. As can be seen in FIG. 25 a gap is formed between thepin 6031 and the V-shaped groove 6032 so that the pin 6031 is not insubstantial contact with the groove 6032. In alternate embodiments thecoupling plate 6010 (and/or pins 6031) may be moved relative to theobject after the object 6000 is mated to the interface 6013 for causingthe formation of the gap 6071 by, for example centering the pin 6031below and/or within a respective one of the grooves 6032. The gap 6071may be such that when the object 6000 is released from interface 6013the V-shaped grooves 6032 are lowered onto and centered with respect tothe pins 6031 so that the object can be removed from, for example, thecoupling plate 6010. It is noted that the object may be suitablyconstrained by the kinematic coupling of the interface 6013 and thecoupling plate 6010 to provide for both the engagement of the object6000 with the interface 6013 as well as the releasing of the object 6000from the interface and re-coupling of the object 6000 with the couplingplate 6010.

Referring to FIG. 6, there is shown a schematic elevation view of acarrier 100′ in accordance with another exemplary embodiment. Carrier100′ may be similar to carrier 100 described previously. In theexemplary embodiment, carrier 100′ has a flexible connection 130′ thatmay provide six degrees of freedom compliance between the kinematiccoupling 110′ (similar to kinematic coupling 110) and the kinematiccoupling 101′. In the exemplary embodiment, kinematic coupling 110′ maybe fixed relative to the carrier shell bottom, and kinematic coupling101′ may be fixed to the carrier shell flange. Accordingly, thecompliant connection may be positioned at any suitable location on thecarrier shell between flange and carrier shell bottom. The locationshown in FIG. 6 is merely exemplary. In the exemplary embodiment, thewafer support structure may be fixed relative to the flange. Anexemplary locking process between the carrier 100′ and the load port isillustrated graphically in the flow chart shown in FIG. 6A. For example,the carrier 100′ is transported to the load port (FIG. 6A, Ref. 11001)and is optionally clamped to the load port (FIG. 6A, Ref. 11002) in amanner substantially similar to that described above with respect toFIG. 4F, Refs. 10600 and 10601. The load port shuttle advances thecarrier 100′ to the carrier/load port interface (FIG. 6A, Ref. 11003).The load port door vacuum may be activated during advancement of thecarrier 100′ so that any particulate matter on the surface of thecarrier may be removed during the interfacing of the carrier and loadport. The load port shuttle presses the carrier 100′ against thecarrier/load port interface to coarsely couple the carrier to the loadport (FIG. 6A, Ref. 11004). The carrier door is clamped to the load portdoor (FIG. 6A, Ref. 11005) and the shell flange clamp vacuum isactivated (FIG. 6A, Ref. 11006). The shell flange clamp causes thecarrier to engage the kinematic coupling for clamping the carrier to theload port (FIG. 6A, Ref. 11007) and the carrier door starts to retract(FIG. 6A, Ref. 11008). The carrier door separates from the carrier (FIG.6, Refs. 11009 and 11010) and is lowered into the door storage area ofthe load port (FIG. 6A, Ref. 11011). In alternate embodiments, thecarrier may be registered to the load port in any suitable manner.

Referring now to FIG. 11 there is shown a schematic plan view of aportion of the coupling interface 110′ in accordance with anotherexemplary embodiment. In the exemplary embodiment, coupling 110′ may becompliant (for example along three primary axis x, y, z) allowing thecarrier shell, and hence the shell flange, six degree of freedom. Inalternate embodiments, coupling compliance may have fewer degrees offreedom. The compliance of the coupling is schematically represented inFIG. 11 by flexibility of the coupling pins 20A in the x, y, zdirections. In alternate embodiments compliance of interface 110′ (seealso FIG. 3) may be effected at one or more other suitable locationssuch as the shuttle plate, the load port flange coupling, the shellflange, the shell coupling grooves for the bottom coupling or the shellattachment to the coupling grooves. As may be realized compliance may bedistributed at a number of locations, such as Z compliance at the pins,and x and y compliance at other locations such as the shell flange.

Referring now to FIGS. 12-12B, there is shown respectively a schematicelevation view of carrier 1100 and load port 1010 in accordance withanother exemplary embodiment. In the exemplary embodiment, the load portand carrier may have generally wedge shaped doors, capable of interfacewith each other. The carrier and load port doors may be clamped andopened by single axis movement, such as in the Z axis. In the exemplaryembodiment, carrier and load port may have registration features 1107(e.g. kinematic coupling capable carrier to load port registration) forvertical loading of the carrier, located on the load port flange (e.g.the same surface the door/carrier/load port) may be located). As may berealized registration interface features may be any arrangement, such asV-groove and pin features as shown in FIGS. 12-12A, that do not overconstrain the interface. In the exemplary embodiment shown, theinterface is configured so that the carrier CG preloads the coupling ina mechanically stable condition. In the exemplary embodiment the doorarrangement may form the opening of the pod door at an angle. The angleis defined by the direction which the load port will extract the doorfrom the carrier. This may form a continuous flat surface which the portand port door can seal to the carrier respectively. The load port axisof motion may also be sloped at the angle of the opening. In alternateembodiments, the motion may be performed in two vectors creating a shortangled motion transitioning to a pure vertical motion as shown in FIG.12B. The drive for the door motion may be from a single source, and forexample may implement a cam action to form the two vectors of motionwith a single line of action. As may be realized, in the exemplaryembodiment, all physical interfaces between the carrier and the loadport may be on the same surface similar to a bottom opening pod, and asingle axis of motion may open the door. Further details of thekinematic coupling capable carrier to load port registration aredescribed in U.S. patent application Ser. No. 11/855,484 filed on Sep.14, 2007, the disclosure of which is incorporated herein by reference inits entirety.

Referring now to FIG. 13, there is shown a schematic elevation view of acarrier and load port interface in accordance with yet another exemplaryembodiment. The carrier 7000 may be configured to hold a self containedgas supply 7001, such as for purging the carrier. The gas supply mayinclude any suitable gas such as, for exemplary purposes only, nitrogen.In the exemplary embodiment, a hollow volume may be provided integral tothe carrier forming a chamber 7002 of a material which can contain apurge gas. The material density can be of a metal or polymer but withthin cross section. This helps minimize the weight gain from the densermaterial. The chamber 7002 may be connected to the internal cavity 7003of the pod 7000 where the wafers reside via for example a check valve.The check valve may serve to regulate the pressure inside the pod andprevent the over pressurization. The chamber may be pressurized at aload port or other nest locations at strategic areas in the process.Once pressurized the carrier 7000 may be stored without connection to agas supply for an extended period of time. The amount of time may bedriven by the size of the chamber and the quality of the seals in thepod.

As can be seen in FIG. 13A in alternate embodiments the gas supply 7001′may be external to the carrier 7000′. The gas supply 7001′ may beremovably coupled to the carrier 7000 by any suitable coupling. In thisexample the gas supply can be recharged as described above with respectto FIG. 13 or when the gas supply is low may be replaced with anothergas supply.

In accordance with another exemplary embodiment a low power pressuresensor 7004 may be integrated onto the carrier 7000. The sensor 7004 maymeasure the pressure in the carrier and report an alarm if the pressuredropped below a critical level. The AMHS system could be commanded toretrieve the carrier 7000 from its current position and place it on apurge nest for recharging.

Suitable examples of carrier gas supplies can be found in U.S. patentapplication Ser. No. 11/855,484 previously incorporated herein byreference.

Pressurizing the carrier with gas via, for example, the gas supply 7001,7001′ when storing or transporting the wafers may minimize wafercontamination if there is a leak in a seal of the carrier. For example,if the door seal has a leak the pressurized gas within the carrier willevacuate the carrier through the leak while not allowing contaminants toenter the carrier, whereas a vacuum environment within the carrier wouldtend to draw the external atmosphere (including contaminants) into thecarrier where the wafers reside. In one embodiment the carriers may bepumped down and refilled with a predetermined gas to clean anycontaminants from the carrier interior when, for example, the carrier islocated at a load port or at a designated carrier cleaning station. Asmay be realized any wafer within the carrier during pump down andrefilling with the predetermined gas may also be cleaned ofcontaminants.

Referring now to FIG. 14, there is shown a schematic partial crosssection of a carrier and load port interface in accordance with anotherexemplary embodiment. As may be realized, a pressure differential mayexist between the carrier environment and the load port environmentprior to opening the carrier 8000. As the carrier door 8001 is opened,pressure may equalize and may introduce an undesirable flow of airacross the wafer carrier. This turbulent flow of air may depositparticulate matter and potentially damage or destroy wafers within thecarrier 8000. Upon closing the carrier door 8001, the displaced volumeof air within the carrier shell is forced outward. This volume of airmay pass over the wafers before exiting into the load port environmentand could potentially deposit harmful particulate.

In the exemplary embodiment, air flow channels 8010 may be provided inthe carrier shell geometry that define a low resistance path for air, orany other gaseous fluid, to enter or escape through. The channels 8010may be located around a perimeter of the carrier shell or any othersuitable location to allow gas to flow out of the carrier 8000. Thechannels 8010 provide a path for air/gas to flow when opening/closingthe carrier door 8001, a pressure relief when the door 8001 is beingopened/closed, a port for evacuating oxygen or any other undesirableparticulate, and/or actively (e.g. evacuate or inject fluid to) controlairflow around the wafer cassette. In the exemplary embodiment, thesechannels may be subjected to a vacuum source and/or a fluid source asdesired when placed on a load port (or other interface). In alternateembodiments they may be open to a suitable environment so that gas canflow to/from the carrier to the environment through the channels. Asuitable valve, such as a check valve 8020, may be disposed in thechannels 8010 to prevent back flow of gas to/from the carrier throughthe channels 8010. In alternate embodiments, a distinct positivepressure port could be used to introduce a gas into the carrier 8000through the channels 8010.

By way of example as the carrier 8000 is placed onto the load portsurface the area around the flow channels 8010 is sealed with anysuitable seal such as seal 8025. Prior to opening the carrier door 8001a vacuum flow is initiated to remove any debris or entrapped gases thatmay be lodged on the carrier surface. As the door 8001 is opened anypressure differential between the load port and carrier environment iseasily equalized due to the large flow area and low pressure. Inalternate embodiments the pressure may be equalized by introducing gasinto the carrier through the channels so a pressure within the carriermatches the pressure of the processing environment to which the carrieris attached. Upon closing the carrier door 8001, the large volume ofair/gas that resides in the carrier must displace. The flow channels8010 and associated vacuum provide a low resistance path for the fluidto travel. This alleviates any “piston effect” that may otherwise beexperienced by the gas within the carrier 8000 and removes any turbulentair flow across the wafers.

Referring now to FIGS. 7A-7C, there are shown respectively crosssectional views and a partial perspective view of a load port plate 14or bulkhead and carriers in accordance with another exemplaryembodiment. The load port or plate defining the load port 14 in theexemplary embodiment may be similar to the load port describedpreviously. As seen in FIG. 7A, the load port 14 may be mated to the FEM4 at a BOLTS plane, that may conform to SEMI E63 standards. In theexemplary embodiment, the load port 14 is arranged to allow door opening(e.g. load port door 12 with the carrier door 104 clamped thereto) to beeffected outside the bolts interface plane. As seen best in FIGS. 7B-7C,the load port bulkhead may define a recess or cavity accommodating doormotion. The cavity may be masked from the FEM interior as shown, so thatthe cavity is substantially hidden from the FEM interior. Also, in theexemplary embodiment the bulkhead face may be substantiallyuninterrupted along the BOLTS interface (other than the ports)minimizing structure that may disturb gas flow within the FEM. In theexemplary embodiment the load port bulkhead may form a return passagefor recirculation of gas in the FEM, as shown for example in FIGS. 1A-1Bassisting in maintaining the door cavity as a clean area. Gas may bedirected into the cavity with suitable registers. In alternateembodiments, inlet or exhaust lines may be plumbed directly to the loadport for introducing or removing gas from/to and external gas supply.Referring also to FIG. 10, in the exemplary embodiment the door openermechanism 111 may be located outside the clean area. In the exemplaryembodiment, the door opener mechanism or door actuator may be similar toactuator 5000 shown in FIGS. 19-20, through in alternate embodiments thedoor actuator may be any actuation system or combination of actuationsystems. As may be realized from FIGS. 7A, 7B, in the exemplaryembodiment the interface surface of the load port bulkhead interfacingthe carrier shell may be offset from the BOLTS interface to accommodatethe door cavity therebetween. Accordingly, and referring now also toFIG. 3, in the exemplary embodiment, the carrier shell may be configuredto accommodate the offset in the load port interface and maintain thefacial datum of the carrier when docked relative to the BOLTS interfacein accordance with semi specifications.

In one embodiment, latches coupling the carrier door 104 to the loadport door 12 may be actuated by, for example, any suitable actuator suchas the actuator described above with respect to FIGS. 19 and 20. In oneexample, in alternate embodiments, the door actuator may include thebladder actuator similar to that described herein and may be combinedwith, for example, an electric motor, lead screw or pneumatic cylinderor any other suitable drive for causing actuation of the door (or otheractuated components) in any desired manner. In another example, when thecarrier is mated with the load port, suitable flow lines such as vacuumlines or purge lines may adjust the atmosphere within the carrier tomatch the atmosphere of the processing tool. In one example, theinterior of the carrier may be pumped down to a predetermined vacuumcreating a pressure differential between the interior of the carrierand, for example, the cavity for accommodating door motion. The pressuredifferential may cause the drive surface 5035 of the actuator to movewhich in turn may actuate a latching mechanism or device coupling thecarrier door 104 to the load port door 12. In another embodiment, forexample, when the carrier door 104 is placed back on the carrier, thelatch between the carrier door 104 and the load port door may bereleased by pressurizing one side of the actuator. For example, thecarrier may be filled with an inert gas such as nitrogen fortransporting the substrates within the carrier. The pressure formedwithin the carrier from filling the carrier with the inert gas may exerta force on (e.g. pressurize) the drive surface of the door actuator(similar to surface 5035 of the actuator (similar to 5000, see FIGS.19-20) causing movement of the actuator which in turn may cause thereleasing of the latch between the carrier door 104 and the load portdoor 12. Actuation of the same or a different actuator 5000 may alsocause the carrier door 104 to be latched to the carrier in a mannersubstantially similar to that described above. As may be realized, inalternate embodiments, one side of the actuator 5000 may be pressurizedfor latching the carrier door to the load port door while in otheralternate embodiments, a pressure differential may be used to releasethe latch between the carrier door and the load port door. In stillother alternate embodiments a pressure differential may be applied orone side of the actuator may be pressurized in any suitable manner forcausing movement of the actuator. As may be realized, the vacuum sourceor pressure source for actuating the actuator 5000 may be from anysuitable source such as, for example, flow lines for purging or pumpingthe carrier as described above or the registers located within thecavity for accommodating door motion. In other embodiments the linearmotion of the actuator may be converted into rotary motion in anysuitable manner. In still other alternate embodiments the actuator mayinclude two bladders connected to a common actuator chamber forproviding two degrees of motion having any spatial relationship to eachother. For example, one of the bladders may be configured to move a doorsubstantially perpendicular relative to a door interface surface of asubstrate passage opening while the second bladder is configured to movethe door substantially parallel to the door interface surface so thatthe substrate passage opening in unobstructed by the door.

Mapping of the carrier substrates may be effected in any desired manner.As a non limiting example, the substrates can be mapped optically withthru-beam sensors (flip-in sensors), thru-beam sensors through clearwindows on sides of the carrier, or with any other suitable opticalsensor. As other non-limiting examples, the sensors can be mappedmechanically with air sensors ported in supports, opto-mechanicallywhere a wafer actuates a plunger where the plunger movement is sensedwith any suitable sensor, by proximity sensors, and electro-mechanicallywith strain gauges that measure the strain of supports substratesupports under weight of a wafer. In alternate embodiments thesubstrates may be mapped in any suitable manner.

Referring now to FIGS. 15 and 15A, there is shown schematic elevationviews of a substrate processing apparatus or tool 1002 and carrier(s)1100 connected thereto in accordance with another exemplary embodiment.The processing apparatus 1002, in the exemplary embodiment shown in FIG.15, is generally similar to the substrate processing tool 2 illustratedin FIG. 1 and described previously, and similar features are similarlynumbered. The process tool 1002 may generally have a process section1006 and FEM 1004 (continuing, for explanation purposes only, with thereference convention in which wafers may be considered to be loaded intothe tool from the front). In the exemplary embodiment, the processsection 1006 and FEM 1004 may share a common controlled environment oratmosphere (e.g. inert gas (N2), (Ar), or very clean dry air). Theprocess section 1006, is shown schematically, and may include one ormore process sections or module(s) connected to the FEM 1004 (thearrangement shown in FIG. 15 is merely exemplary and the FEM and processsection module(s) may be connected to each other in any desiredarrangement in alternate embodiments). The process section(s) ormodule(s) 1006 may be capable of being isolated from the FEM 1004, suchas with a closable opening (e.g. a gate valve). Accordingly, the processsection may also be provided with a different process atmosphere thanthe FEM atmosphere. In alternate embodiments, the process section mayinclude a load lock allowing process modules with dissimilar atmospheresor holding a vacuum to be connected to the FEM as will be describedfurther below.

The FEM 1004 in the exemplary embodiment shown in FIG. 15, may besimilar to FEM 4 (see FIGS. 1-14) except as otherwise noted. The FEM1004 may include suitable environmental controls to maintain a desiredcontrolled environment or atmosphere in the FEM when substrate aretransported to and from the process section 1006. For example, the FEM1004 may include a controller 31000, one or more fluid control valves31010, 31020, a pressure relief or check valve 31030 and sensors, suchas for example, pressure sensor 31040, contamination sensor 31041 andtemperature sensor 31042. The controller may be configured to adjust orregulate attributes such as the temperature pressure and rate of gasflow 31050 of the controlled environment within the FEM (and processsection 1006). For example, the controller 31000 may receive signalsfrom the pressure sensor 31040, temperature sensor 31042 andenvironmental contamination sensor 31041. Depending on the environmentalinformation in those signals the controller may release or increasepressure within the FEM, increase or reduce air flow 31050 within theFEM by actuating the appropriate valves 31010, 31030. The controller31000 may also be configured to increase or decrease the temperature ofthe gas within the FEM (e.g. via adjusting coolant flow through radiator31060) based on temperature readings provided by temperature sensor31042. As may be realized, while the controller 31000 and associatedvalves and sensors are described with respect to FIGS. 15 and 15A, thecontroller 31000 may be used to control the environment(s) of the otherembodiments disclosed herein.

The FEM 1004 may include a substrate transport apparatus or robot 1004R(the robot, as may be realized, may be of any desired type) capable ofholding and transporting substrates. Similar to FEM 4 described before,in the exemplary embodiment, the FEM 1004 may include a carrierinterface 1010 for interfacing one or more carrier(s) 1100 to the tool1002, and allowing substrates to be loaded and unloaded to and from thetool 1002. The interface, which has also been referred to herein as aload port, of the FEM 1004, and a corresponding complementing interfaceportion of the carrier(s) 1100, may be configured to enable loading andunloading of substrates between carrier and FEM without degradation ofthe controlled environment in the FEM 1004 and process section 1006. TheFEM load port 1010, and complementing interface portion of the carrier1100, which may be collectively referred to as the carrier to FEMinterface, may be arranged so that carrier(s) 1100 interfaced to theFEM, are integrated into the tool. By way of example, the carrier(s) sointegrated via the interface, may define a chamber(s) sharing the samecontrolled atmosphere as the FEM, and thus capable of holding substratesin the same controlled atmosphere as the FEM, so that substrates may betransported directly from carrier 1100 to process section or processmodule by the FEM transport robot 1004R. Similar to the exemplaryembodiments described before, the carrier to FEM interface in theexemplary embodiment shown in FIG. 15, defines what has been referred tobefore as a clean tunnel (with substantially the same cleanliness asthroughout the FEM and process section) from within the carrier chamber,through the interface into the FEM, and throughout the process section.The clean tunnel may be closed (such as when the carrier(s) is removedfrom the load port), and opened freely without degradation to the cleantunnel. In the exemplary embodiment shown in FIG. 15, the carrier to FEMinterface may also be arranged to enable direct integration of thecarrier with the tool (substantially as described above) independent ofcarrier environment prior to interface, as will be further describedbelow. Thus, in the exemplary embodiment illustrated in FIG. 15, thecarrier(s) 1100 may be interfaced with and integrated directly toprocess tools having different or dissimilar environments (e.g. cleanair to inert gas environment, or clean air to vacuum) and then transportdirectly between tools with different dissimilar environment andinterfaced and integrated again with the tools as will be describedfurther below. Accordingly, a substrate(s) at one tool with a controlledenvironment may be transferred directly with the FEM robot, from theprocess section (similar to process section 1006) through the cleantunnel into the carrier(s), the carrier(s) 1100 transported directly andinterfaced to the FEM (similar to FEM 1004) of another tool possiblywith a dissimilar/different controlled environment, and the substrate(s)transferred directly with the FEM robot through the clean tunnel nowdefined in the other tool to the process section without degradation ofthe controlled environment in the other process tool. In effect, thecarrier to FEM interface in combination with the carrier may beconsidered to define an exterior load lock, or carrier load lock.

Referring still to FIG. 15, and as noted before, the load port 1010 ofFEM 1004 may be similar to load port 10 described previously. In theexemplary embodiment illustrated in FIG. 15, the load port 1010 is showninterfacing with one carrier 1100 for example purposes, though inalternate embodiments, the load port may be arranged to interface withany desired number of carriers. For example, in alternate embodiments,the load port may have a generally stacked configuration capable ofinterfacing a number of carriers arrayed in a stack similar to thearrangement shown in FIG. 1. In the exemplary embodiment, the load port1010 may have a vacuum source 1010V capable of being communicablyconnected to the carrier(s) 1100 held on the load port in order to pumpdown the carrier, for example to clean molecular contaminants from thecarrier interior and substrates therein when the carrier is on the loadport. Conversely, the carrier may be arranged to communicably interfacewith the vacuum source 1010V at the load port and to withstandatmospheric pressure in the carrier casement when the carrier is pumpeddown to vacuum. As noted above, the vacuum source 1010V for pumping downthe carrier may also effect the actuation of an actuator 5000 forcoupling the carrier door to the load port door via a pressuredifferential in a manner substantially similar to that described abovewith respect to FIG. 7 (See also FIGS. 19 and 20). For example, the loadport door may interface with the carrier door through a vacuuminterface. The interior volume of the carrier may be pumped to a highervacuum than the load port/carrier door vacuum interface to create apressure differential between the two for effecting movement of theactuator. In other exemplary embodiments the vacuum interface betweenthe load port door and the carrier door may effect the movement of theactuator 5000 for latching the carrier door and load port door to eachother. In alternate embodiments, as also noted above, a surface of theactuator may be pressurized in any suitable manner, such as for example,when the carrier is purged with the inert gas. In alternate embodiments,the load port door may include a vacuum/purge flow line that interfacesdirectly with the actuator (e.g. the actuator seals around the flowline) for creating a pressure differential or for pressurizing one sideof the actuator.

In the exemplary embodiment shown in FIG. 15, the carrier is illustratedas a side opening carrier (having the carrier door located in a sidewall of the carrier), through in alternate embodiments the carrier doormay be located in any carrier wall, such as top or bottom walls of thecarrier. The carrier 1100 may have any desired size and may be a smalllot carrier (for example with a capacity of 5 or less substrates) or maybe sized to have any desired transport capacity such as 13, 25 or anyother desired number of substrates. The carrier may have a metal housingfor example of aluminum or stainless steel, or any other material(including non-metallic materials or metal for lined non-metallicmaterials) so that the housing is substantially impermeable to gasmolecules. As noted before, the carrier housing may also be suitablyarranged to hold a vacuum therein (for example a sufficiently highvacuum for effective cleaning of molecular contaminants within thecarrier, and vacuum comparable to vacuum processes, e.g. about 1×10⁻³torr) with the carrier housing exterior subject to atmospheric pressure.The carrier housing structure may be arranged to have any suitable wallthickness (such as for exemplary purposes only about ⅛″ in the case ofstainless steel) and may have stiffeners 10950 suitably dimensioned andpositioned along one or more of the sides, top and/or bottom of thecarrier as shown in FIG. 26 to minimize deflections of carrier housing.The stiffeners 10950 may be configured as ribs or any other suitablestiffening member for minimizing deflection of the walls of the carrier.In other exemplary embodiments, the walls of the carrier may be domedwalls 10960 to use, for example, hoop stresses to strengthen the wallsand minimize deflection of the carrier as can be seen in FIG. 27. Inalternate embodiments the walls of the carrier may have any suitableconfiguration for minimizing deflection of the walls. The carrier 1100may have similar coupling features (e.g. kinematic couplings for dockingwith the load port upon delivery from an over head transport for exampleand for engaging the carrier side opening to the corresponding load portopening to effect the clean tunnel through the load port) to carrier 100described before. The carrier housing may be suitably arranged so thatany deflections of the carrier housing, when the carrier interior issubjected to vacuum, to not degrade the operation of the couplings. Thecarrier 1100 may have suitable passages and orifice(s) or ports so thaton connection or coupling the carrier with the load port, the vacuumsource 1010V of the load port is automatically coupled to the carrierhousing and communicates with the carrier interior. The location of thevacuum port shown in FIG. 15 is merely exemplary, and in alternateembodiments the vacuum port may be positioned as desired. For example,in alternate embodiments the vacuum passages and port on the carrier(and conversely on the load port) may be similar to that shown in FIG.14 (e.g. flow channels formed in the mating face of the carrier withinthe sealed interface region between carrier side and load port rim). Asmay be realized, carrier seals (see FIG. 3) have desired integrity towithstand vacuum across the seal.

As seen in FIG. 15, in the exemplary embodiment illustrated, the carrier1100 may also be configured to be communicably connected to a gas feed,such as a source of vent or purge gas. In the exemplary embodiment shownin FIG. 15, the carrier 1100 may be communicably connected to gas source1010G, when seated on the carrier support of the load port 1010. As maybe realized, the carrier may have a suitable inlet port (plug (andsuitable gas channels connecting the carrier interior) to couple (forexample automatically) to a nozzle of the gas feed 1010G, such as whenthe carrier is placed on the load port support surfaces. The arrangementof the gas source interface between load port and carrier shown in FIG.15 is merely exemplary and in alternate embodiments the gas sourceinterface between carrier and load port may have any other desiredlocation and configuration. As noted before, the gas source 1010G may becapable of providing for example purge and/or vent gas to the carrierseated on or located at the load port 1010. By way of example, with thecarrier 1100 suitably positioned (such as from an overhead transport) atload port 1010, and the gas feed nozzle connected to the carrier to feedgas into the carrier housing, a purge gas (e.g. N2) may be fed into thecarrier if desired (depending on the interior atmosphere of the carrierwhen positioned at the load port, and the environment being maintainedin the FEM). Thus, if the carrier for example contains some processatmosphere, (such as from an interface with a previous tool), and theFEM 1004 may be maintained with an inert gas or very clean airatmosphere, that may be dissimilar from the carrier atmosphere, uponpositioning the carrier at the load port, desired purge gas may be fedinto the carrier such as via gas feed 1010G, purging the carrieratmosphere so that the carrier may be interfaced with the load portopening and integrated to the tool 1002 is previously described.Moreover, in the event that carrier atmosphere is consideredincompatible with or possibly presenting undesired contaminants to, theFEM environment, upon positioning the carrier at the load port (but forexample before opening the carrier interior to the FEM environment), thecarrier interior may be pumped to sufficient vacuum via vacuum source1010V, and filled with the inert gas (e.g. N2, very clean air) similarto the environment in the FEM to clean the potential contaminants fromthe carrier, and allowing integration of the carrier to the tool aspreviously described. As noted above, the purge gas feed 1010G may, inaddition to or in lieu the vacuum source 1010V, operate the actuator5000 in a manner substantially similar to that described above.Information regarding the carrier atmosphere may be recorded on a RFID(radio frequency identification) tag, or other suitable data storagedevice, capable of being read (or otherwise accessed) by a suitablereader at or proximate to the load port 1010 with which the carrier isbeing loaded. Accordingly, suitable information regarding the carrierinterior may be obtained by the tool controller (see also FIG. 16),reviewed with a desired protocol and if desired the carrier may bepumped and vented as previously described when positioned at the loadport. Information regarding the carrier atmosphere for example may berecorded on the carrier borne storage device when the carrier is dockedto the load port, or any other suitable time. Such information may alsobe tracked by a FAB wide controller if desired. As may be realized, thecarrier 1100 may also be interfaced with a FEM that may not have vacuumand gas feed connections. In alternate embodiments, the carrier mayinclude an internal or onboard source of purge gas (similar to theembodiment shown in FIG. 13), to effect purging the carrier whenpositioned at a load port. As may be realized, in alternate embodiments,the load port interface interfacing with the carrier may be providedwith a vacuum connection, and no gas feed, that gas being provided forexample from a gas source on board the carrier. Thus, as may be realizedthe carrier may now serve as a substrate cleaning chamber of the tool,storing substrates at the tool so they are undergoing cleaning. As maybe realized, the carrier pump/vent may also be performed prior toremoval of the carrier from the load port such as when repositioning toa conventional tool.

As noted before, the arrangement of the load port and carrier to toolinterface shown in FIG. 15 is merely exemplary, and in alternateembodiments, the interface may have any other desired configuration. Forexample, the gas feed may be positioned as desired to vent gas from FEMenvironment into the carrier after the carrier interior has been pumped.Referring now also to FIG. 16, there is shown a plan view of anotherprocess tool 7002 in accordance with another exemplary embodiment, thetool 2002, in the exemplary embodiment shown in FIG. 16 is generallysimilar to the process tool 1002 shown in FIG. 15 and described before(similar features are similarly numbered) the tool 2002 may haveprocessing modules 2006, 2006A, and FEM 2004 with a desired controlledatmosphere (e.g. inert gas or very clean air). One or more of theprocess modules 2006 may be connected to the FEM so that the FEMtransport robot 2004R may pick/place substrates in the process module(as shown in FIG. 16 and similar to embodiment shown in FIG. 15).Process modules 2006, 2006A (though one process module is shown in FIGS.15, 16, 16A, in alternate embodiments a stack of process modules may bejoined to the FEM or to each of the one or more transfer modules) mayshare a common atmosphere with the FEM 2004. FEM 2004 may have a loadinginterface or load port, for loading and interfacing a carrier 2100 tothe tool in an integral manner similar to that described previously. TheFEM transport robot 2004R in the exemplary embodiment may pick/placesubstrates directly between carrier 2100 and one or more processmodule(s) 2006 through a clean tunnel similar to that previouslydescribed. In the exemplary embodiment shown in FIG. 16, the cleantunnel 2005 that is defined through the FEM interface 2010 into thecarrier interior, and extends into the process modules 2006, 2006A maybe varied in length or configuration (for example in a manner similar toU.S. application Ser. No. 11/422,511, filed May 26, 2006; U.S.application Ser. No. 10/624,987, filed Jul. 22, 2003; U.S. applicationSer. No. 10/962,787, filed Oct. 9, 2004; U.S. application Ser. No.11/442,509, filed May 26, 2006 and U.S. application Ser. No. 11/441,711,filed May 26, 2006 all incorporated by reference herein in theirentirety). In the exemplary embodiment, transfer module(s) 2008 may beconnected to the FEM, so that the FEM robot may pick/place substratesinto the transfer module. The location of the transfer module(s) ismerely exemplary. As may be realized, the clean tunnel may continue toextend from the FEM through the transfer module. More or fewer transfermodule(s) 2008, 2008A may be connected to each other (for exampleserially, such as shown in phantom in FIG. 16) to vary the length andconfiguration of the clean tunnel as desired. Process modules (similarto modules 2006, 2006A) may be joined to the clean tunnel so thatsubstrates may be transferred through the clean tunnel, for exampleto/from the carrier 2010 and any desired process module, or between anydesired process modules. In the exemplary embodiment shown, the transfermodule 2008 may have a transport robot inside the module, for example totransport substrates to/from process modules 2006A, or to an adjoiningtransfer module/chamber 2006A. In alternate embodiments, the transfermodule may have no internal robot, the substrates being placed/pickedthere from by robots inside adjoining modules of the clean tunnel 2005,as will be described below with respect to FIGS. 16A, 16B. In stillother exemplary embodiments, the transfer module may have any suitablelength and include any suitable substrate transfer apparatus. Forexample, as can be seen in FIG. 16A, the clean tunnel 2005′ may besubstantially similar to the clean tunnel described above with respectto FIG. 16 and include a module forming an elongated chamber having atransfer cart(s) configured to traverse the chamber. The transfer cartmay be a passive cart (e.g. without a transfer arm/robot) similar to thetransfer cart described in U.S. patent application Ser. No. 10/962,787filed on Oct. 9, 2004, the disclosure of which is incorporated herein byreference in its entirety. For example, the transfer cart may be amovable cart that may be integrated with the chamber. The cart may beconfigured to translate back and forth in the chamber between front 18Fand back 18B. The cart(s) may define multiple independent transportpaths within the clean tunnel (e.g. one for each load port door, or onefor each process module of a module stack joined to the clean tunnel).The cart may be configured to traverse the chamber such that particulate(that may contaminate the substrates) is not introduced into the cleantunnel 2005′. For exemplary purposes only, in one embodiment, the cartmay be a magnetically levitated cart or have any other suitable drivesystem for moving the cart without releasing contaminants into the cleantunnel. The cart of the transport apparatus 2004R′ has end effectors forholding one or more substrates. As can also be seen in FIG. 16A,transfer chambers 2004T are coupled to the clean tunnel 2005′. One ormore of the transfer chambers 2004T may include transport arms 2004R(configured for operation in e.g. a vacuum environment) for transportingsubstrates from the cart 2004C into processing chambers 2006, 2006Acoupled to the transfer chambers 2004T. In the exemplary embodiment thetransport arms 2004R in a transfer chamber may define multiple transportpaths, for example, vertically stacked or offset transport paths tovertically offset process modules communicating with the transportchamber. To pick or release substrates from the cart 2004C, the cart2004C may be aligned with desired module/port and the arm 2004R isextended/retracted through the corresponding port to position the endeffector for picking/releasing the substrate from/to the cart 2004C. Inthis example, the clean tunnel may be include clean tunnel extension2005E that may extend the clean tunnel in any suitable directionforming, for example a grid through which the cart(s) 2004C can pass fortransporting substrates from the carrier 2100 to the processing modules.As may be realized there may be more than one transport path for thecart 2004C to follow while traversing the clean tunnel 2005′, 2005E. Inone example, the transport paths may be vertically spaced from eachother so that carts can pass over/under each other or to verticallyadjust a height of the cart so the cart is aligned with processingmodules/transfer chambers that are vertically stacked one above theother. In alternate embodiments the cart transport paths may behorizontally spaced from each other. The FEM 2004′ shown in FIG. 16A maybe substantially similar to FEM 2004 in FIG. 16 however, FEM 2004′ mayinclude more than one load port for coupling carriers to the FEM. Inthis example the load ports are shown as being horizontally spaced fromeach other but in alternate embodiments the load ports may be verticallyspaced one above the other.

Referring now to FIG. 16B, another exemplary processing tool is shown.In this example, the processing tool includes a clean tunnel 2005″ thatmay be substantially similar to clean tunnel 2005′, 2005E. Similarly,transport modules and processing modules may be coupled to the cleantunnel 2005″. In this example, the transport apparatus 2004C′ may be anysuitable transport apparatus such as, a passive or active cart(s) (e.g.including a substrate transport arm/robot), a series of transport robotslocated in substantially line within the clean tunnel and configured topass substrates from one robot to another or any other suitableapparatus for transporting substrates through the clean tunnel 2005″. Inother alternate embodiments the clean tunnel may be formed by a seriesof transfer modules that include transport arms configured for holdingsubstrates. The transport modules may be coupled to each other to formthe clean tunnel. It should be understood that the ports allowingpassage between the process modules, transfer modules, clean tunnel andcarrier may be configured to isolate a respective portion of the tool2002′ so that one or more of the different portions of the tool 2002′may include atmospheres that are different from each other.

Referring back to FIG. 16, in the exemplary embodiment, the transfermodule(s) 2008, 2008A of the clean tunnel in tool 2002, may share thecommon controlled (e.g. inert gas, very clean air) of the FEM. Inalternate embodiments, one or more of the transfer module(s) 2008, 2008Amay be configured as a load lock so that portions of the clean tunnelmay hold different atmospheres (for example the clean tunnel portiondefined within the FEM may have a N2 environment, and the portion withinthe module 2008A may have a vacuum environment, transfer module 20008may be a load lock capable of cycling substrates between the inert gasatmosphere in the FEM, and the vacuum atmosphere in module 2008A).

As may be realized, in addition to being interfaceable with an FEM(Similar to that shown in FIGS. 15-16), the carrier may be interfaceddirectly with a vacuum portion of a process tool. Referring now to FIG.17, there is shown a substrate process tool 3002 and carrier 3100connected thereto. Carrier 3100 may be similar to carrier 1100 describedpreviously. The process tool 3002 is generally similar to the processtools described before with a front loading section 3004 (maintainingthe convention as previously discussed with the tool being loaded fromthe front and process section 2006 (of process modules) 3006) connectedthereto. In the exemplary embodiment shown in FIG. 17, the front loadingsection 3004 may be configured to hold a vacuum (or any other desiredatmosphere). The loading section 3104 may have a chamber interface orload port 3010, generally similar to the load port interface 10, 1010described before, except as otherwise noted, and capable of receivingcarrier 3100 and interfacing the carrier directly to the vacuumatmosphere in the loading section. As may be realized, the carrieropening to load port rim interface, similar to that previouslydescribed, provides sufficient integrity so that when the carrier isintegrated directly thereto and opened (for example) to the vacuumatmosphere within the loading section 3004 there is no appreciabledegradation in the vacuum atmosphere and the clean tunnel extending fromthe carrier interior through the carrier-load port interface, theloading section 3004 and process module(s) 3006 communicating with theclean tunnel. Thus, when the carrier integrated with the clean tunnel,the substrate robot, 3004R inside the vacuum loading section maypick/place substrates inside the carrier and the process module(s) 3006and directly transfer substrates therebetween via the clean tunnel. Thearrangement illustrated in FIG. 17 is merely exemplary. The loadingopening of front loading section 3004 may be closable, such as with avacuum gate valve (or other suitable closure), in order to maintainvacuum inside section 3004 when the carrier is not interfaced. In theexemplary embodiment, the loading section may also include a foresection 3012, that may be located forward of the vacuum gate valve forexample, and may interface or be connected to the port interface for thecarrier 3001 (similar to interface 101 described before, see also FIG.3). The fore section 3012 may also have a closable opening (closable,for example with a door similar to door 8014 shown in FIG. 3), throughwhich the loading section communicates with the carrier interior andthrough which the clean tunnel extends. As may be realized, the foresection 3012 may also have a vacuum atmosphere, when the carrier isinterfaced and the carrier is opened. The fore section may for examplebe arranged, so that the carrier door is removable (similar to thatpreviously described) from the carrier, through the loading opening intothe fore section. In the exemplary embodiment, the fore section may notbe a load lock, (though in alternate embodiments it may be) as thecarrier 3100 may become a load lock (as previously described). Thus, thesubstrates may be held in the carrier and atmosphere (for example thecarrier may hold and inert gas atmosphere during intertool transport)may be pumped (such as with vacuum source 3010V, similar to the vacuumsource previously described) to establish a commensurate vacuum with theprocess vacuum in the transfer chamber of the loading section. Withdesired vacuum established in the carrier, the vacuum gate valve may beopened so that the vacuum robot in the loading section may pick/placesubstrates inside the carrier. The carrier door may be opened after thecarrier is pumped to vacuum (in the exemplary embodiment the foresection may also have a vacuum environment to facilitate opening of thecarrier door and the clean tunnel established to extend from carrierinterior, through the interface openings the fore section, the transferchamber and process module(s) communicating therewith. In the exemplaryembodiment, the fore section may have an inert atmosphere (to minimizepotential for contaminant entry) between carrier interfaces, that may bepumped to desired vacuum prior to opening the carrier door (as may berealized suitable vacuum source and gas feed may be provided to the foresection). In alternate embodiments, the carrier door may be openedbefore pumping the atmosphere from the carrier (e.g. the carrier door isopened with the fore section having an inert gas atmosphere), and theatmosphere in both carrier and fore section may be pumped simultaneouslyeither via a vacuum source in the fore section, or vacuum source coupledto a vacuum orifice on the carrier (as previously described). In theexemplary embodiment, after closing the carrier door in anticipation oftransfer to another tool, the carrier 3100 may be filled, via feed 3010Gwith a suitable inert gas (e.g. Nz).

As noted before, the arrangement of the process tool 3002 and carrier totool interface may have any desired configuration. Referring now also toFIG. 18, there is shown a plan view of another process tool 4002 inaccordance with another exemplary embodiment. The tool 4002 in theexemplary embodiment shown in FIG. 18 is generally similar to theprocessing tool 3002 shown in FIG. 17 and described before (similarfeatures are similarly numbered). The tool 4002 may have processingmodules 4006, 4006A, and FEM 4004 with for example a vacuum atmosphere(or in alternate embodiments inert gas or very clean dry air). One ormore of the process modules 4006 (such as for example in verticallystacked or offset arrangement) may be connected to the vacuum FEM sothat the vacuum transport robot 4004R may pick/place substrate in theprocess module as shown in FIG. 18 and similar to embodiment shown inFIG. 16. Process modules 4006, 4006 a may share a common process vacuumwith the loading section 4004. FE 4004 may have a loading interface orload port, for loading and interfacing a carrier 4100 to the tool in anintegral manner similar to that described previously. The vacuumtransport robot 4004R in the exemplary embodiment may pick/placesubstrates directly between carrier 4100 and one or more processmodule(s) 4006,4006A through a clean tunnel similar to that previouslydescribed. In the exemplary embodiment shown in FIG. 18 the clean tunnel4005 that is defined through the FEM interface 4010, 4012 into thecarrier interior and extends into the process modules 4006, 4006A may bevaried in length or configuration

Referring now to FIG. 18A, in accordance with another exemplaryembodiment, the processing tool may be configured such that the carrier4100 is coupled directly to the atmosphere of the clean tunnel 2005′ asdescribed above with respect to FIG. 18. In this example, a transportrobot 4004R may be located adjacent the carrier for transportingsubstrates from the carrier to a transport cart(s), for example asubstrate transport system that may be substantially similar to thetransport cart(s) described above with respect to FIGS. 16A, 16B. Asdescribed above the cart(s) may be moved to a desired location withinthe clean tunnel 2005′ such that a transport robot 4004R, in a transfermodule communicating with the clean tunnel, may transfer substratesbetween the processing modules 4006 and the clean tunnel. In theexemplary embodiment, the clean tunnel transport system may definemultiple substrate transport paths (e.g. particularly offset) in theclean tunnel between the carrier(s) and process modules 4006. In theexemplary embodiment the process modules 4006 at each process modulestation may be arranged in a vertically stacked manner. Thus asubstrate(s) from a carrier at the load port may be transported to acorresponding to a corresponding process module(s) of the tool andreturned to the respective carrier substantially independent of otherprocess paths of substrate(s) from the other carriers. In alternateembodiments, the cart may include an articulated arm or movable transfermechanism for extending and retracting the end effectors in order topick or release substrates directly from the processing modules 4006 ortransport robots 4004R adjoined to the clean tunnel 2005′. FIG. 18Billustrates another processing tool in which the carriers 4100 arecoupled directly to the clean tunnel. In this example, the processingtool may be substantially similar to the clean tunnel described abovewith respect to FIG. 18A, however the transportation system 2004C′ maybe substantially similar to the transportation system described beforewith respect to FIG. 16B. It should also be realized that the cleantunnel (or portions thereof) may have transport paths vertically orhorizontally spaced from each other, as described above, for allowingthe transport of substrates throughout the processing tool or todifferent processing modules or carrier that may be vertically stackedone above the other or located side by side from each other.

The disclosed system may provide:

Stops crystal growth/corrosion

Relax queue time rules and simplifies storage management

Removes air Et halogen Et organic compounds and moisture

Suppresses FAB cross contamination risks

Low CoO

Eliminates airborne molecular contaminants AMC such as HF, HCL, VOC incarrier environment and on the substrate

Protects carrier and substrate within the carrier from contaminatedenvironments for days

Active gas passivation protection on both substrate and carrier,

POD ambient refreshing and protection

Integrated gas measurement with spectra signature analysis.

It should be understood that the exemplary embodiments described hereincould be used individually or in any suitable combination(s). It shouldalso be understood that the foregoing description is only illustrativeof the invention. Various alternatives and modifications can be devisedby those skilled in the art without departing from the invention.Accordingly, the present invention is intended to embrace all suchalternatives, modifications and variances.

What is claimed is:
 1. A substrate carrier configured for coupling to aload port of a substrate processing system that includes a processingsection having a processing vacuum and where the load port includes aBOLTS interface, the substrate carrier comprising: a shell having shellwalls and kinematic coupling features disposed on at least one side wallof the shell walls and being configured to couple the shell with theBOLTS interface of the load port; and an internal volume formed by theshell, the internal volume including substrate supports; wherein theshell includes reinforcing members disposed on the shell, thereinforcing members are configured to reinforce the shell with anexterior of the shell exposed to an atmospheric environment and with theinternal volume at the processing vacuum so that the kinematic couplingfeatures provide repeatable coupling of the shell with the BOLTSinterface with the internal volume pumped down to the processing vacuumand the exterior of the shell exposed to the atmospheric environment andwith the internal volume pumped down to the processing vacuum and thesubstrate carrier substantially located in an atmospheric environment,where the processing vacuum corresponds to at least one vacuum processfrom the group of material deposition, ion implantation, etching andlithography, the reinforcing members include reinforcing members thatare distinct from the shell walls and the substrate supports, andwherein with the internal volume at the processing vacuum, therepeatable coupling of the shell with the BOLTS interface extends theprocessing vacuum from the internal volume through the repeatablecoupling of the shell with the BOLTS interface to the processingsection.
 2. The substrate carrier of claim 1, wherein the reinforcingmembers are integral to sides of the shell.
 3. The substrate carrier ofclaim 1, wherein the processing vacuum is a processing pressure of thesubstrate processing system.
 4. A substrate processing systemcomprising: a processing section arranged to hold a processingatmosphere therein; a carrier having a shell forming an internal volumefor holding at least one substrate for transport to the processingsection, the shell being configured to hold a pumped down pressurewithin the internal volume where the pumped down pressure ispredetermined processing vacuum pressure that is different than anexterior atmosphere outside the substrate processing system; and a frontend load port communicably connected to the processing section toisolate the processing atmosphere from the exterior atmosphere, thefront end load port having a BOLTS interface and being configured tocouple with the carrier to pump down the internal volume of the carrierto the predetermined processing vacuum and to communicably connect thecarrier to the processing section, for loading the substrate into theprocessing section through the front end load port, and thepredetermined processing vacuum extends from the internal volume of thecarrier through the BOLTS interface to the processing section.
 5. Thesubstrate processing system of claim 4, wherein: the front end load portis configured for allowing access to the processing atmosphere of theprocessing section through at least one sealable load port opening thatis sealable with a load port door, the at least one sealable load portopening being disposed in a load port opening plane; the BOLTS interfaceis located substantially along and defining the load port opening planeand configured to interface with a side of the carrier on which acarrier opening is located, and where the load port door interfaces witha carrier door; and the BOLTS interface has common kinematicregistration features that are common to the load port opening plane andengage the side of the carrier, on which the carrier opening is located,effecting kinematically repeatable positioning of the carrier in atleast three perpendicular axes to the BOLTS interface independent of aclosure of the load port door.
 6. The substrate processing system ofclaim 5, wherein the common kinematic registration features areconfigured to effect a kinematic coupling between the BOLTS interfaceand the side of the carrier on which the carrier opening is located. 7.The substrate processing system of claim 5, further comprising ahandling system configured to effect registration of the carrier withthe common kinematic registration features.
 8. The substrate processingsystem of claim 5, wherein the BOLTS interface forms a seal with theside of the carrier after contact between the carrier and the BOLTSinterface.
 9. The substrate processing system of claim 8, wherein theseal between the side of the carrier and the BOLTS interface seals ashared high vacuum atmosphere between the processing atmosphere and thecarrier.
 10. The substrate processing system of claim 5, wherein thecarrier door is configured to interface with the load port door aftercontact between the side of the carrier and the BOLTS interface.
 11. Thesubstrate processing system of claim 5, wherein the BOLTS interfaceincludes a flange that substantially surrounds the at least one sealableload port opening, where the flange is configured to interface with theside of the carrier on which the carrier opening is located.
 12. Thesubstrate processing system of claim 5, wherein the BOLTS interfaceincludes a flange that substantially surrounds the at least one sealableload port opening, where the flange is configured to interface with acarrier flange.
 13. The substrate processing system of claim 1, whereinthe predetermined processing vacuum that extends from the processingsection through the at least one sealable load port opening.
 14. Thesubstrate processing system of claim 4, wherein the predetermined vacuumpressure is a pressure of the processing atmosphere.
 15. The substrateprocessing system of claim 4, wherein the substrate processing system isconfigured for transporting substrates directly from the carrier to theprocessing section in a vacuum environment.
 16. The substrate processingsystem of claim 4, wherein the load port is further configured tointroduce a gas into the internal volume for pressurizing the carrier.17. The substrate processing system of claim 4, further comprising acarrier station apart from the front end load port, the carrier stationbeing configured to pump down the carrier to the predetermined vacuumpressure or pressurize the carrier through an introduction of gas. 18.The substrate processing system of claim 4, wherein at least the shellof the carrier is constructed of a metal.
 19. The substrate processingsystem of claim 4, wherein the shell of the carrier includes reinforcingribs on one or more sides of the shell.
 20. The substrate processingsystem of claim 4, further comprising a transport module communicablyconnecting the load port to the processing section, the transport modulecomprising an internal passage formed between the carrier and theprocessing section wherein the internal passage is a substantiallycontaminant free environment.
 21. The substrate processing system ofclaim 20, further comprising a movable cart configured to traverse theinternal passage and hold substrates for transfer through the transportmodule.
 22. The substrate processing system of claim 21, wherein themovable cart includes a transfer arm configured to transfer at least onesubstrate directly between the carrier and the processing section. 23.The substrate processing system of claim 21, further comprising atransfer module connecting the transport module to the processingsection, the transfer module includes a transfer arm configured to holdat least one substrate and to transfer the at least one substrate fromthe movable cart to the processing section.
 24. The substrate processingsystem of claim 20, wherein a pressure of the carrier and internalpassage are the same as a pressure of the processing section.
 25. Thesubstrate processing system of claim 4, wherein: the carrier isconfigured to hold at least one substrate in a predetermined substrateplane for transport to the processing section, the carrier having aclosable opening on a side of the carrier, the side framing more thanone edge of the opening and both the side and the opening being orientedat an angle relative to the substrate plane; and the front end load portcomprises registration features to engage the side of the carrierframing the closable opening and effect repeatable positioning of thecarrier to the front end load port.
 26. The substrate processing systemof claim 4, wherein the carrier comprises a portable gas supply, theportable gas supply being configured to maintain a predeterminedpressure within the carrier during transport and/or storage of thecarrier.
 27. A method comprising: coupling a substrate carrier to afront end load port of a substrate processing system that includes aprocessing section having a processing vacuum and where the front endload port includes a BOLTS interface; and pumping down an internalvolume of the substrate carrier to a predetermined vacuum pressure whileone or more exterior surfaces of the substrate carrier are exposed to anatmospheric environment, where the process vacuum extends from aninternal volume of the substrate carrier through the BOLTS interface tothe processing section.
 28. The method of claim 27, wherein thepredetermined vacuum pressure is a processing pressure of the substrateprocessing system.
 29. The method of claim 27, further comprisingtransferring at least one substrate from the substrate carrier to aprocessing module of the substrate processing system.